SCOPUS 정보 검색 플랫폼

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2014, Pages 480-483

Development and characterization of graphene-enhanced thermal conductive adhesives

(6) Casa, Marcello a Huang, Shirong b Ciambelli, Paolo c Wang, Nan a Ye, Lilei d Liu, Johan a,b

a CHALMERS UNIVERSITY OF TECHNOLOGY (Sweden)

b School of Mechatronics and Mechanical Engineering (China)

c UNIVERSITY OF SALERNO (Italy)

d SHT SMART HIGH TECH AB (Sweden)

Author keywords

additive; chemical; dopamine coating; graphene based TCA; silver coating; thermal conductivity

Indexed keywords

ADDITIVES; ADHESIVES; AMINES; CHEMICALS; COATINGS; ELECTRONICS PACKAGING; FILLED POLYMERS; GRAPHENE; HYBRID MATERIALS; SILVER;

CHEMICAL EXFOLIATIONS; CONDUCTIVITY IMPROVEMENT; ENHANCED THERMAL CONDUCTIVITY; FUNCTIONALIZED GRAPHENE; HOMOGENEOUS COMPONENTS; HOTSPOT TEMPERATURE; SILVER COATINGS; THERMAL CHARACTERIZATION;

THERMAL CONDUCTIVITY;

EID: 84908110099 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2014.6922700 Document Type: Conference Paper

Times cited : (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.