Thermal characterization of power devices using graphene-based film

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2014, Pages 459-463

  Zhang, Pengtu ^a,b   Wang, Nan ^a   Zanden, Carl ^a   Ye, Lilei ^c   Fu, Yifeng ^c   Liu, Johan ^a,d  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c SHT SMART HIGH TECH AB   (Sweden)

^d School of Mechatronics and Mechanical Engineering   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONIC PROPERTIES; GRAPHENE DEVICES; LIGHT EMITTING DIODES; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY OF SOLIDS; THIN FILMS;

CONDUCTIVE ADHESIVE; FUNCTIONAL LAYER; FUNCTIONALIZED GRAPHENE; HIGH THERMAL CONDUCTIVITY; INTERFACE THERMAL RESISTANCE; LOWER TEMPERATURES; THERMAL CHARACTERIZATION; THERMAL PERFORMANCE;

GRAPHENE;

EID: 84907903298     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2014.6897324     Document Type: Conference Paper

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