Lithography challenges for 2.5D interposer manufacturing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2014, Pages 523-527

  Cochet, Klaus Ruhmer Philippe ^a   McCleary, Roger ^a   Rogoff, Rich ^a   Roy, Rajiv ^a  

^a Rudolph Technologies Inc ^*  (United States)

Author keywords

2.5D; 3D; Advanced Packaging; backside alignment; Glass Interposer; IR alignment; MCM; Multichip Module; overlay; Panel; RDL; Redistribution Layer; Si Interposer; sidewall angle; Stepper; thick resist; Through Glass Via; Through Silicon Via; TSG; TSV

Indexed keywords

ALIGNMENT; CHIP SCALE PACKAGES; COST BENEFIT ANALYSIS; COST REDUCTION; GLASS; GLASS INDUSTRY; INTEGRATED CIRCUIT INTERCONNECTS; LITHOGRAPHY; MICROPROCESSOR CHIPS; MULTICARRIER MODULATION; MULTICHIP MODULES; PROGRAMMABLE LOGIC CONTROLLERS; SILICON WAFERS; SUBSTRATES; SYSTEM-ON-CHIP;

2.5D; ADVANCED PACKAGING; BACK-SIDE ALIGNMENTS; IR ALIGNMENT; OVERLAY; PANEL; REDISTRIBUTION LAYERS; SI INTERPOSERS; SIDEWALL ANGLES; STEPPER; THICK RESIST; THROUGH GLASS VIA; THROUGH-SILICON-VIA;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84907897437     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2014.6897334     Document Type: Conference Paper

References (8)

1. Clive Maxfield, EE Times Article, 4/8/2012: "2D vs. 2.5D vs. 3D ICs 101"
2. Aric Shorey, Alan Huffman, John Keech, Matt Lueck, Scott Pollard, Philippe Cochet, Klaus Ruhmer (Corning, RTI, Rudolph): Advancements in Fabrication of Glass Interposers, ECTC 2014, Orlando, FL.
3. Rich Rogoff, Rudolph Technologies: A Square Peg in a Round Hole - The Economics of Panel-based Lithography for Advanced Packaging Applications, Rudolph internal publication, February 2014
4. Ron Huemoeller, AMKOR Technology, Architectural Success of 2.1D & 2.5D, SEMI 3D Summit, Grenoble, France, January 2014
5. M. Juergen Wolf, Fraunhofer IZM ASSID, 3D Technology as a Holistic Approach, SEMI 3D Summit, Grenoble, France, January 2014
6. Eric Beyne, IMEC, Cost analysis 2.5D and 3D system integration, SEMI 3D Summit, Grenoble, France, January 2014
7. Michael Thiele, GlobalFoundries, Enabling 2.5D Technology for Commercialization, SEMI 3D Summit, Grenoble, France, January 2014
8. N. Sillon, CAE LETI, From 3D Toolbox to 3D Integration: Examples of Successful 3D Applicative Demonstrators, SEMI 3D Summit, Grenoble, France, January 2013