Thermally enhanced 3 dimensional integrated circuit (TE3DIC) packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2014, Pages 601-608

  Snyder, S ^a   Thompson, J ^a   King, A ^a   Walters, E ^a   Tyler, P ^a   Weatherspoon, M R ^a  

^a Government Communications Systems Division ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BINARY ALLOYS; CHIP SCALE PACKAGES; CHROMIUM ALLOYS; COPPER; DIES; ELECTROMAGNETIC SHIELDING; FLIP CHIP DEVICES; HEAT RESISTANCE; HEATING EQUIPMENT; INTEGRATED CIRCUIT DESIGN; REDUCTION; SPREADERS; THERMAL CONDUCTIVITY; TIMING CIRCUITS;

COPPER HEAT SPREADER; ELECTROMAGNETIC (EM) COUPLING; HETEROGENEOUS MATERIALS; HIGH THERMAL CONDUCTIVITY; PACKAGING SOLUTIONS; PLATINUM TEMPERATURE SENSORS; SENSITIVE COMPONENTS; THROUGH-SILICON VIA (TSV) TECHNOLOGIES;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84907896557     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2014.6897347     Document Type: Conference Paper

References (10)

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