Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2014, Pages 1071-1076

  Desmaris, V ^a,b   Saleem, A M ^a,b   Shafiee, S ^a,b   Berg, J ^a,b   Kabir, M S ^a,b   Johansson, A ^a,b  

^a SMOLTEK AB   (Sweden)

^b Phil Marcoux PPM Associ   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CARBON NANOFIBERS;

BONDING MATERIALS; CHIP TO PACKAGES; INTERCONNECTION RELIABILITY; ON CHIP INTERCONNECT; REINFORCING MATERIALS; ROBUST SOLUTIONS; SOLDER INTERCONNECTIONS; THERMAL COMPRESSIONS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84907886227     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2014.6897421     Document Type: Conference Paper

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