Performance characterization of advanced interconnects on high speed VLSI circuits

European Solid-State Device Research Conference

Volumn , Issue , 2000, Pages 216-219

  Bermond, C ^a   Flechet, B ^a   Le Carval, G ^b   Charlet, F ^b   Morand, Y ^c   Angenieux, G ^a   Salik, R ^d  

^a UNIVERSITÉ DE SAVOIE   (France)

^b CEA LETI   (France)

^c STMICROELECTRONICS   (France)

^d Silvaco Data Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; SOLID STATE DEVICES; VLSI CIRCUITS;

CHARACTERISTIC IMPEDANCE; CMP PROCESS; EM MODELING; HIGH-SPEED PERFORMANCE; HIGH-SPEED SIGNALS; LOW K DIELECTRICS; PERFORMANCE CHARACTERIZATION; PROPAGATION CONSTANT;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84907858956     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.2000.194753     Document Type: Conference Paper

References (5)

1. C. Crégut et al., IITC, San Francisco, June 98
2. A. Deutsch et al, IBM J. Res. Develop., vol.33, n°5, Sept. 95
3. F. Charlet et al., submitted to SISPAD, Seattle, Sept. 2000
4. R.B. Marks, D.F. Williams, IEEE Microwave and Guided Wave Letters, vol. 1, no. 9, Sept. 1991
5. C. Bermond et al., Workshop IEEE on Signal Propagation Interconnects (SPI), Maggdeourg, May 2000