TiW as a direct contact material and a diffusion barrier to n+ and p+ implanted areas

European Solid-State Device Research Conference

Volumn , Issue , 1987, Pages 191-195

  Lindberg, A ^a   Ostling, M ^a   Norstrom, H ^b   Wennstrom, U ^b  

^a Swed Inst Microwave Technol/M   (Sweden)

^b RIFA AB ^*  (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT CONTACT;

EID: 84907820217     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)