-
1
-
-
77950214388
-
Materials and mechanics for stretchable electronics
-
Rogers, J.A.; Someya, T.; Huang, Y. Materials and mechanics for stretchable electronics. Science 2010, 327, 1603–1607.
-
(2010)
Science
, vol.327
, pp. 1603-1607
-
-
Rogers, J.A.1
Someya, T.2
Huang, Y.3
-
2
-
-
79953038482
-
Materials for multifunctional balloon catheters with capabilities in cardiac electrophysiological mapping and ablation therapy
-
Kim, D.-H.; Lu, N.; Ghaffari, R.; Kim, Y.-S.; Lee, S.P.; Xu, L.; Wu, J.; Kim, R.-H.; Song, J.; Liu, Z.; et al. Materials for multifunctional balloon catheters with capabilities in cardiac electrophysiological mapping and ablation therapy. Nat. Mater. 2011, 10, 316–323.
-
(2011)
Nat. Mater.
, vol.10
, pp. 316-323
-
-
Kim, D.-H.1
Lu, N.2
Ghaffari, R.3
Kim, Y.-S.4
Lee, S.P.5
Xu, L.6
Wu, J.7
Kim, R.-H.8
Song, J.9
Liu, Z.10
-
3
-
-
80051607518
-
Epidermal electronics
-
Kim, D.-H.; Lu, N.; Ma, R.; Kim, Y.-S.; Kim, R.-H.; Wang, S.; Wu, J.; Won, S.M.; Tao, H.; Islam, A.; et al. Epidermal electronics. Science 2011, 333, 838–843.
-
(2011)
Science
, vol.333
, pp. 838-843
-
-
Kim, D.-H.1
Lu, N.2
Ma, R.3
Kim, Y.-S.4
Kim, R.-H.5
Wang, S.6
Wu, J.7
Won, S.M.8
Tao, H.9
Islam, A.10
-
4
-
-
1942424145
-
Design and performance of thin metal film interconnects for skin-like electronic circuits
-
Lacour, S.P.; Jones, J.; Suo, Z.; Wagner, S. Design and performance of thin metal film interconnects for skin-like electronic circuits. IEEE Electron. Dev. Lett. 2004, 25, 179–181.
-
(2004)
IEEE Electron. Dev. Lett.
, vol.25
, pp. 179-181
-
-
Lacour, S.P.1
Jones, J.2
Suo, Z.3
Wagner, S.4
-
5
-
-
84897552123
-
Soft microfluidic assemblies of sensors, circuits, and radios for the skin
-
Xu, S.; Zhang, Y.; Jia, L.; Mathewson, K.E.; Jang, K.-I.; Kim, J.; Fu, H.; Huang, X.; Chava, P.; Wang, R.; et al. Soft microfluidic assemblies of sensors, circuits, and radios for the skin. Science 2014, 344, 70–74.
-
(2014)
Science
, vol.344
, pp. 70-74
-
-
Xu, S.1
Zhang, Y.2
Jia, L.3
Mathewson, K.E.4
Jang, K.-I.5
Kim, J.6
Fu, H.7
Huang, X.8
Chava, P.9
Wang, R.10
-
6
-
-
84864263729
-
Microfluidic electronics
-
Cheng, S.; Wu, Z.G. Microfluidic electronics. Lab Chip 2012, 12, 2782–2791.
-
(2012)
Lab Chip
, vol.12
, pp. 2782-2791
-
-
Cheng, S.1
Wu, Z.G.2
-
7
-
-
78149396093
-
Microfluidic stretchable RF electronics
-
Cheng, S.; Wu, Z.G. Microfluidic stretchable RF electronics. Lab Chip 2010, 10, 3227–3234.
-
(2010)
Lab Chip.
, vol.10
, pp. 3227-3234
-
-
Cheng, S.1
Wu, Z.G.2
-
8
-
-
38049057110
-
A multiaxial stretchable interconnect using liquid-alloy-filled elastomeric microchannels
-
Kim, H.J.; Son, C.; Ziaieb, B. A multiaxial stretchable interconnect using liquid-alloy-filled elastomeric microchannels. Appl. Phys. Lett. 2008, doi:10.1063/1.2829595.
-
(2008)
Appl. Phys. Lett.
-
-
Kim, H.J.1
Son, C.2
Ziaieb, B.3
-
9
-
-
42549111682
-
Eutectic gallium–indium (EGaIn): A liquid metal alloy for the formation of stable structures in microchannels at room temperature
-
Dickey, M.D.; Chiechi, R.C.; Larsen, R.J.; Weiss, E.A.; Weitz, D.A.; Whitesides, G.M. Eutectic gallium–indium (EGaIn): A liquid metal alloy for the formation of stable structures in microchannels at room temperature. Adv. Funct. Mater. 2008, 18, 1097–1104.
-
(2008)
Adv. Funct. Mater.
, vol.18
, pp. 1097-1104
-
-
Dickey, M.D.1
Chiechi, R.C.2
Larsen, R.J.3
Weiss, E.A.4
Weitz, D.A.5
Whitesides, G.M.6
-
11
-
-
60449112624
-
biaxial stretchable interconnect with liquid-alloy-covered joints on elastomeric substrate
-
Kim, H.J.; Maleki, T.; Wei, P.; Ziaie, B. A biaxial stretchable interconnect with liquid-alloy-covered joints on elastomeric substrate. J. Electromech. Syst. 2009, 18, 138–146.
-
(2009)
J. Electromech. Syst.
, vol.18
, pp. 138-146
-
-
Kim, H.J.1
Maleki, T.2
Wei, P.3
Ziaie, B.A.4
-
12
-
-
84884908294
-
3D printing of free standing liquid metal microstructures
-
Ladd, C.; So, J.-H.; Muth, J.; Dickey, M.D. 3D printing of free standing liquid metal microstructures. Adv. Mater. 2013, 25, 5081–5085.
-
(2013)
Adv. Mater.
, vol.25
, pp. 5081-5085
-
-
Ladd, C.1
So, J.-H.2
Muth, J.3
Dickey, M.D.4
-
13
-
-
84902362002
-
Direct writing of gallium–indium alloy for stretchable electronics
-
Boley, J.W.; White, E.L.; Chiu, G.T.-C.; Kramer, R. Direct writing of gallium–indium alloy for stretchable electronics. Adv. Funct. Mater. 2014, 24, 3501–3506.
-
(2014)
Adv. Funct. Mater.
, vol.24
, pp. 3501-3506
-
-
Boley, J.W.1
White, E.L.2
Chiu, G.T.-C.3
Kramer, R.4
-
14
-
-
84891532578
-
Pervasive liquid metal based direct writing electronics with roller-ball pen
-
Zheng, Y.; Zhang, Q.; Liu, J. Pervasive liquid metal based direct writing electronics with roller-ball pen. AIP Adv. 2013, 3, doi:10.1063/1.4832220.
-
(2013)
AIP Adv.
, pp. 3
-
-
Zheng, Y.1
Zhang, Q.2
Liu, J.3
-
15
-
-
84878246861
-
Liquid-phase gallium–indium alloy electronics with microcontact printing
-
Tabatabai, A.; Fassler, A.; Usiak, C.; Majidi, C. Liquid-phase gallium–indium alloy electronics with microcontact printing. Langmuir 2013, 29, 6194–6200.
-
(2013)
Langmuir.
, vol.29
, pp. 6194-6200
-
-
Tabatabai, A.1
Fassler, A.2
Usiak, C.3
Majidi, C.4
-
16
-
-
84886048580
-
3D Structures of liquid-phase Ga In alloy embedded in PDMS with freeze casting
-
Fassler, A.; Majidi, C. 3D Structures of liquid-phase Ga In alloy embedded in PDMS with freeze casting. Lab Chip 2013, 13, 4442–4450.
-
(2013)
Lab Chip.
, vol.13
, pp. 4442-4450
-
-
Fassler, A.1
Majidi, C.2
-
17
-
-
84902126143
-
Rapid prototyping for soft-matter electronics
-
Lu, T.; Finkenauer, L.; Wissman, J.; Majidi, C. Rapid prototyping for soft-matter electronics. Adv. Funct. Mater. 2014, 24, 3351–3356.
-
(2014)
Adv. Funct. Mater.
, vol.24
, pp. 3351-3356
-
-
Lu, T.1
Finkenauer, L.2
Wissman, J.3
Majidi, C.4
-
18
-
-
84867563828
-
Liquid alloy printing of microfluidic stretchable electronics
-
Jeong, S.H.; Hagman, A.; Hjort, K.; Jobs, M.; Sundqvist, J.; Wu, Z.G. Liquid alloy printing of microfluidic stretchable electronics. Lab Chip 2012, 12, 4657–4664.
-
(2012)
Lab Chip
, vol.12
, pp. 4657-4664
-
-
Jeong, S.H.1
Hagman, A.2
Hjort, K.3
Jobs, M.4
Sundqvist, J.5
Wu, Z.G.6
-
19
-
-
84887827299
-
Masked deposition of gallium–indium alloys for liquid-embedded elastomer conductors
-
Kramer, R.K.; Majidi, C.; Wood, R.J. Masked deposition of gallium–indium alloys for liquid-embedded elastomer conductors. Adv. Funct. Mater. 2013, 23, 5292–5296.
-
(2013)
Adv. Funct. Mater.
, vol.23
, pp. 5292-5296
-
-
Kramer, R.K.1
Majidi, C.2
Wood, R.J.3
-
20
-
-
84907499401
-
Adhesive transfer soft lithography: A low-cost and flexible rapid prototyping of microfluidic devices
-
Jeong, S.H.; Hjort, K.; Wu, Z.G. Adhesive transfer soft lithography: A low-cost and flexible rapid prototyping of microfluidic devices. Micro Nanosyst. 2014, doi:10.2174/1876402906666140527000508.
-
(2014)
Micro Nanosyst.
-
-
Jeong, S.H.1
Hjort, K.2
Wu, Z.G.3
|