A multilayer process for the connection of fine-pitch-elements on three-dimensionally molded interconnect devices (3D-MIDs)

Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008

Volumn , Issue , 2008, Pages

  Leneke, Thomas ^a   Majcherek, Soeren ^a   Hirsch, Soeren ^a   Schmidt, Bertram ^a  

^a OTTO VON GUERICKE UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; INTEGRATION; MOEMS; MULTILAYERS; NETWORK COMPONENTS;

ELECTRICAL CONNECTION; LEVEL OF INTEGRATIONS; MECHANICAL SUPPORT; MINIATURIZED SYSTEMS; MOLDED INTERCONNECT DEVICES; MULTILAYER PROCESS; SEMICONDUCTOR PACKAGES; TECHNOLOGICAL PROGRESS;

INJECTION MOLDING;

EID: 84907403970     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th International Congress Molded Interconnect Devices, Erlangen, 2002
2. th International Congress Molded Interconnect Devices, Fuerth, 2006
3. S. Hirsch, S. Majcherek, B. Schmidt; Characterizing mechanical stress, Global SMT & Packaging, Volume 7, No. 1, S. 20-22, 2007