-
1
-
-
34347366327
-
Composite polymer-core silica-shell abrasive particles during oxide CMP: A defectivity study
-
S. Armini, C.M. Whelan, K. Maex, J.L. Hernandez, and M. Moinpour Composite polymer-core silica-shell abrasive particles during oxide CMP: a defectivity study J. Electrochem. Soc. 154 2007 H667 H671
-
(2007)
J. Electrochem. Soc.
, vol.154
-
-
Armini, S.1
Whelan, C.M.2
Maex, K.3
Hernandez, J.L.4
Moinpour, M.5
-
2
-
-
49149096626
-
Composite polymer core-ceria shell abrasive particles during oxide CMP: A defectivity study
-
S. Armini, J. De Messemaeker, C.M. Whelan, M. Moinpour, and K. Maex Composite polymer core-ceria shell abrasive particles during oxide CMP: a defectivity study J. Electrochem. Soc. 155 2008 H653 H660
-
(2008)
J. Electrochem. Soc.
, vol.155
-
-
Armini, S.1
De Messemaeker, J.2
Whelan, C.M.3
Moinpour, M.4
Maex, K.5
-
3
-
-
80455176986
-
Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper
-
L. Zhang, H. Wang, Z. Zhang, F. Qin, W. Liu, and Z. Song Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper Appl. Surf. Sci. 258 2011 1217 1224
-
(2011)
Appl. Surf. Sci.
, vol.258
, pp. 1217-1224
-
-
Zhang, L.1
Wang, H.2
Zhang, Z.3
Qin, F.4
Liu, W.5
Song, Z.6
-
6
-
-
77950530448
-
Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive
-
H. Lei, N. Bu, R. Chen, P. Hao, S. Neng, X. Tu, and K. Yuen Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive Thin Solid Films 518 2010 3792 3796
-
(2010)
Thin Solid Films
, vol.518
, pp. 3792-3796
-
-
Lei, H.1
Bu, N.2
Chen, R.3
Hao, P.4
Neng, S.5
Tu, X.6
Yuen, K.7
-
7
-
-
78650679797
-
Chemical effect on the material removal rate in the CMP of silicon wafers
-
Y.G. Wang, L.C. Zhang, and A. Biddut Chemical effect on the material removal rate in the CMP of silicon wafers Wear 270 2011 312 316
-
(2011)
Wear
, vol.270
, pp. 312-316
-
-
Wang, Y.G.1
Zhang, L.C.2
Biddut, A.3
-
8
-
-
77958047968
-
Polishing behaviors of single crystalline ceria abrasives on silicon dioxide and silicon nitride CMP
-
M. Oh, R.K. Singh, S. Gupta, and S. Cho Polishing behaviors of single crystalline ceria abrasives on silicon dioxide and silicon nitride CMP Microelectron. Eng. 87 2010 2633 2637
-
(2010)
Microelectron. Eng.
, vol.87
, pp. 2633-2637
-
-
Oh, M.1
Singh, R.K.2
Gupta, S.3
Cho, S.4
-
9
-
-
78649710945
-
Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP
-
M. Oh, J. Nho, S. Cho, J. Lee, and R.K. Singh Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP Powder Technol. 206 2011 239 245
-
(2011)
Powder Technol.
, vol.206
, pp. 239-245
-
-
Oh, M.1
Nho, J.2
Cho, S.3
Lee, J.4
Singh, R.K.5
-
10
-
-
84880932300
-
2 for ruthenium-film chemical mechanical planarization
-
2 for ruthenium-film chemical mechanical planarization Appl. Surf. Sci. 282 2013 844 850
-
(2013)
Appl. Surf. Sci.
, vol.282
, pp. 844-850
-
-
Cui, H.1
Park, J.2
Park, J.3
-
11
-
-
43049103836
-
Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP
-
S. Armini, C.M. Whelan, M. Moinpour, and K. Maex Composite polymer core-silica shell abrasives: the effect of the shape of the silica particles on oxide CMP J. Electrochem. Soc. 155 2008 H401 H406
-
(2008)
J. Electrochem. Soc.
, vol.155
-
-
Armini, S.1
Whelan, C.M.2
Moinpour, M.3
Maex, K.4
-
12
-
-
49749134371
-
Engineering polymer core-silica shell size in the composite abrasives for CMP applications
-
S. Armini, C.M. Whelan, and K. Maex Engineering polymer core-silica shell size in the composite abrasives for CMP applications Electrochem. Solid-State Lett. 11 2008 H280 H284
-
(2008)
Electrochem. Solid-State Lett.
, vol.11
-
-
Armini, S.1
Whelan, C.M.2
Maex, K.3
-
13
-
-
79959364961
-
2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP
-
2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP Appl. Surf. Sci. 257 2011 8679 8685
-
(2011)
Appl. Surf. Sci.
, vol.257
, pp. 8679-8685
-
-
Chen, Y.1
Lu, J.2
Chen, Z.3
-
15
-
-
78649921463
-
Preparation, characterization and oxide CMP performance of composite polystyrene-core ceria-shell abrasives
-
Y. Chen, J. Lu, and Z. Chen Preparation, characterization and oxide CMP performance of composite polystyrene-core ceria-shell abrasives Microelectron. Eng. 88 2011 200 205
-
(2011)
Microelectron. Eng.
, vol.88
, pp. 200-205
-
-
Chen, Y.1
Lu, J.2
Chen, Z.3
-
16
-
-
20444406055
-
Controlled growth of monodisperse silica spheres in the micron size range
-
W. Stöber, A. Fink, and E. Bohn Controlled growth of monodisperse silica spheres in the micron size range J. Colloid. Interface. Sci. 26 1968 62 69
-
(1968)
J. Colloid. Interface. Sci.
, vol.26
, pp. 62-69
-
-
Stöber, W.1
Fink, A.2
Bohn, E.3
-
19
-
-
33645417558
-
A novel method for the fabrication of monodisperse hollow silica spheres
-
M. Chen, L.M. Wu, S.X. Zhou, and B. You A novel method for the fabrication of monodisperse hollow silica spheres Adv. Mater. 18 2006 801 806
-
(2006)
Adv. Mater.
, vol.18
, pp. 801-806
-
-
Chen, M.1
Wu, L.M.2
Zhou, S.X.3
You, B.4
-
20
-
-
25844528173
-
Preparation of silica-coated polystyrene hybrid spherical colloids
-
M. Chen, S. Zhou, L.M. Wu, S. Xie, and Y. Chen Preparation of silica-coated polystyrene hybrid spherical colloids Macromol. Chem. Phys. 206 2005 1896 1902
-
(2005)
Macromol. Chem. Phys.
, vol.206
, pp. 1896-1902
-
-
Chen, M.1
Zhou, S.2
Wu, L.M.3
Xie, S.4
Chen, Y.5
-
21
-
-
0025417082
-
Chemical processes in glass polishing
-
L. Cook, Chemical processes in glass polishing, J. Non-Cryst. Solids 120 (190) 152-171.
-
J. Non-Cryst. Solids
, vol.120
, Issue.190
, pp. 152-171
-
-
Cook, L.1
|