Recycling printed circuit boards

Waste Electrical and Electronic Equipment (WEEE) Handbook

Volumn , Issue , 2012, Pages 287-311

  Li, Jinhui ^a   Zeng, Xianlai ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Benefit; Composition; Cost; Life cycle; Printed circuit boards; Recycling

Indexed keywords

CHEMICAL ANALYSIS; COMPUTATIONAL ELECTROMAGNETICS; COSTS; ELECTRONIC EQUIPMENT; ELECTRONIC WASTE; FLAME RETARDANTS; LIFE CYCLE; PACKAGING MATERIALS; RECYCLING; TIMING CIRCUITS; WASTE MANAGEMENT; WASTES;

BENEFIT; BEST AVAILABLE TECHNOLOGIES; BROMINATED FLAME RETARDANTS (BFRS); ELECTRICAL EQUIPMENT; ELECTRONIC COMPONENT; LESS DEVELOPED COUNTRIES; PRINTED CIRCUIT BOARD (PCBS); RECYCLING EFFICIENCY;

PRINTED CIRCUIT BOARDS;

EID: 84906666219     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1533/9780857096333.3.287     Document Type: Chapter

References (37)

1. Brandstotter M., Knoth R., Kopacek B., Kopacek P. Closing the loop of printedwire-boards and electronic devices: experiences from automatic disassembling as an input for manufacturers 2004, 182-185.
2. Chris Y., Yuan H., Zhang C., et al. Experimental studies on cryogenic recycling of printed circuit board. Journal of Advanced Manufacture Technology 2007, 34:657-666.
3. Coombes C.F. Coombes' Printed Circuits Handbook 2001, McGraw-Hill.
4. Cui J., Forssberg E. Mechanical recycling of waste electric and electronic equipment: a review. Journal of Hazardous Materials 2004, B99:243-263.
5. Ding X., Xiang D., Lium X., Yang J.M. Delamination failure in plastic IC packages disassembled from scrapped printed circuit boards engineering 2008, Pusan, Korea.
6. Duan H., Hou K., Li J., Zhu X. Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns. Journal of Environmental Management 2011, 92:392-399.
7. Gao P., Xiang D., Yang J., et al. Optimization of PCB disassembly heating parameters based on genetic algorithm. Modern Manufacturing Engineering 2008, 8:92-95. (in Chinese).
8. Guo J., Guo J., Xu Z. Recycling on non-metallic fractions from waste printed circuit boards: a review. Journal of Hazardous Materials 2009, 168:567-590.
9. Huang K., Guo J., Xu Z. Recycling of waste printed circuit boards: a review of current technologies and treatment status in China. Journal of Hazardous Materials 2009, 164:399-406.
10. Kemmlein S., Hahn O., Jann O. Emissions of organophosphate and brominated flame retardants from selected consumer products and building materials. Atmospheric Environment 2003, 37:5485-5493.
11. Kim B., Lee J., Seo S., Park Y., Sohn H. A process for extracting precious metals from spent printed boards and automobile catalysts. JOM 2004, 56(12):55-58.
12. Kogan V. Process for the Recovery of Precious Metals Scrap by Means of Hydrometallurgical Technique 2006, Patent Application, WO 6006/013568 A3, 2006.
13. LaDou J. Printed circuit board industry. International Journal of Hygiene and Environmental Health 2006, 209:211-219.
14. Legarth J.B., Alting L., Danzer B., et al. A new strategy in the recycling of printed circuit boards. Circuit World 1995, 21:10-15.
15. Li J., Tian B., Liu T., et al. Status quo of e-waste management in mainland China. Journal of Material Cycles and Waste Management 2006, 8:13-20.
16. Li J., Xu Z., Zhou Y. Application of corona discharge and electrostatic force to separate metals and nonmetals from crushed particles of waste printed circuit boards. Journal of Electrostatics 2007, 65:233-238.
17. Li J., Duan H., Yu K., et al. Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmospheres. Resources, Conservation and Recycling 2010, 54:810-815.
18. Liu X., Tanaka M., Matsui Y. Electrical and electronic waste management in China, progress and the barriers to overcome. Waste Management & Research 2006, 24:92-101.
19. Lji M., Yokoyama S. Recycling of printed wiring boards with mounted electronic components. Circuit World 1997, 23(3):10-15.
20. Ma J., Wang Z., Li J. Study on recovery of copper from waste printed wiring boards by electrostatic separation. Environmental Science 2006, 27(9):1895-1900. (in Chinese).
21. Ogunniyi I.O., Vermaak M.K.G., Groot D.R. Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations. Waste Management 2009, 29:2140-2146.
22. Ongondo F.O., Williams I.D., Cherrett T.J. How are WEEE doing? A global review of the management of electrical and electronic wastes. Waste Management 2011, 31:714-730.
23. Quan C., Li A., Gao N., et al. Characterization of products recycling from PCB waste pyrolysis. Journal of Analytical and Applied Pyrolysis 2010, 89:102-106.
24. Shuey S.A., Vildal E.E., Taylor P.R. Pyrometalurgical processing of electronic waste. SME Annual Meeting 2006, 27-29. March, 2006, St. Louis, MO. Preprint 06-037.
25. Tange L., Drohmann D. Waste electrical and electronic equipment plastics with brominated fire retardants - from legislation to separate treatment - thermal processes. Polymer Degradation and Stability 2005, 88:35-40.
26. Watanabe I., Sakai S. Environmental release and behaviour of brominated flame retardants. Environment International 2003, 29:665-682.
27. Wen X., Li J., Zou L., et al. Study on comminution performance of waste printed wiring boards at ambient temperature. Mining & Metallurgy 2005, 14(4):57-62. (in Chinese).
28. Williams E., Kahhat R., Allenby B. Environmental, social and economic implications of global reuse and recycling of personal computers. Environmental Science & Technology 2008, 42:6446-6454.
29. Wu J., Li J., Xu Z. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board. Journal of Hazardous Materials 2009, 161:257-262.
30. Xiang D., Mou P., Wang J., Duan G., Zhang H.C. Printed circuit board recycling process and its environmental impact assessment. International Journal of Advanced Manufacturing Technology 2007, 34:1030-1036.
31. Yi R., Chen X., Shen L., Hu J. Study on the equipment for automatic dismantling of electronic components in printed circuit boards scrap. Agricultural Equipment & Vehicle Engineering 2007, 9:46-48. (in Chinese).
32. Yoo J., Jeong J., Yoo K., et al. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill. Waste Management 2009, 29:1132-1137.
33. Zhang S., Forssberg E. Mechanical separation-oriented characterization of electronic scrap. Resource, Conservation and Recycling 1997, 21:247-269.
34. Zhao Y., Wen X., Li B., Tao D. Recovery of copper from printed circuit boards. Minerals and Metal Processing 2004, 21(2):99-102.
35. Zheng Y., Shen Z., Cai C., et al. The reuse of nonmetals recycled from waste printed circuit boards as reinforcing fillers in the polypropylene composites. Journal of Hazardous Materials 2009, 163:600-606.
36. Zheng Y., Shen Z., Ma S., et al. A novel approach to recycling of glass fibers from non-metal materials of waste printed circuit boards. Journal of Hazardous Materials 2009, 170:978-982.
37. Zhou Y., Qiu K. A new technology for recycling materials from waste printed circuit boards. Journal of Hazardous Materials 2010, 175:823-828.