GaAs wafer breakage reduction

CS MANTECH 2014 - 2014 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2014, Pages 53-56

  Darley, Bruce ^a   Singh, Manjeet ^a   Santos, Patrick ^a   Ambrocio, Ernesto ^a   Tiku, Shiban ^a  

^a SKYWORKS SOLUTIONS INC   (United States)

Author keywords

GaAs wafers; Wafer breakage; Yield

Indexed keywords

GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MANUFACTURE;

BREAKAGE RATES; GAAS WAFER; MICROSCRATCHES; SKYWORKS; STRENGTH REDUCTION; TOOL TYPES; WAFER STRENGTH; YIELD;

SEMICONDUCTING GALLIUM;

EID: 84906545884     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. T. Cordner and B. Marks, "GaAs Breakage, Causes, Cures, Growth and Process", GaAs IC Symposium, 317, (1993).
2. S. Wdowik", Reduction of Wafer Breakage in a 4 inch GaAs Wafer Fab Facility through the Implementation of a Biaxial Stress Test", GaAS MANTECH, (1990).
3. M. Schaper et al.", Fracture Mechanical Evaluation of GaAs Wafers", Progress in Semiconductors II, Electronics and Optoelectronics, 744, MRS Proceedings (2002).