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Volumn 2, Issue 35, 2014, Pages 7184-7187

A carbon fiber solder matrix composite for thermal management of microelectronic devices

(7) Murugesan, Murali a Zandén, Carl a Luo, Xin a,b Ye, Lilei c Jokubavicius, Valdas d Syväjärvi, Mikae d Liu, Johan a,b

a CHALMERS UNIVERSITY OF TECHNOLOGY (Sweden)

b SHANGHAI UNIVERSITY (China)

c SHT SMART HIGH TECH AB (Sweden)

d LINKÖPING UNIVERSITY (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBERS; CARBONIZATION; GOLD COATINGS; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; TEMPERATURE CONTROL; TITANIUM ALLOYS;

MESOPHASE PITCH; SPUTTER COATING; TEMPERATURE CYCLES; THERMAL CONTACT RESISTANCE; THERMAL MANAGEMENT APPLICATIONS; THERMAL MANAGEMENT OF MICRO-ELECTRONIC DEVICE; THROUGH-PLANE THERMAL CONDUCTIVITIES; TIN-SILVER-COPPER ALLOYS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84906076315 PISSN: 20507534 EISSN: 20507526 Source Type: Journal
DOI: 10.1039/c4tc00936c Document Type: Article

Times cited : (24)

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