Preparation and properties of bisphenol A epoxy resin microcapsules coated with melamine-formaldehyde resin

Polymer Bulletin

Volumn 71, Issue 9, 2014, Pages 2407-2419

  Wang, Hai Ping ^a   Hu, Si Qian ^a   Cai, Shao Jun ^a   Yu, Fan ^a  

^a JIANGHAN UNIVERSITY   (China)

Author keywords

Epoxy resin; In situ polymerization; Melamine formaldehyde; Microcapsule

Indexed keywords

ELECTRONICS PACKAGING; EMULSIFICATION; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PARTICLE SIZE ANALYSIS; POLYMERIZATION; SELF-HEALING MATERIALS; SURFACE ACTIVE AGENTS; THERMOGRAVIMETRIC ANALYSIS;

BISPHENOL A EPOXY RESIN; DIFFERENTIAL THERMALS; DIGLYCIDYL ETHER OF BISPHENOL-A; ELECTRONIC PACKAGING; IN-SITU POLYMERIZATION; LASER PARTICLE SIZE ANALYZER; MELAMINE-FORMALDEHYDE; MICROCAPSULES;

ENCAPSULATION;

EID: 84905814543     PISSN: 01700839     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00289-014-1198-y     Document Type: Article

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