Rearrangement of novolak resins

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2195, Issue , 1994, Pages 685-695

  Dalil Rahman, M ^a   Dammel, Ralph ^a   Durham, Dana ^a  

^a Hoechst Celanese Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONICS;

CHAIN SCISSION; MICROELECTRONICS INDUSTRY; NOVOLAK; NOVOLAK RESIN; POSSIBLE MECHANISMS;

RESINS;

EID: 84904708517     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.175382     Document Type: Conference Paper

References (6)

1. Herzog, W. , Z. Anqew. Chem. 34, 97(1921).
2. Allen, I, Meharg, E. , Schmid, J. H. , md. Ençi. Chem. , 26, 663(1 934).
3. Hoyt, H. E. , Keuckel, H. W. , Dean, R. B. , Paint & Varnish Production, 48, 33-36 (195)
4. Gipstein, E. , Ouano, A. C. , Tomkins, T. , J. Electrochem. Soc. , 129, 201 , (1 982).
5. Khadim, M. , Rahman, M. D. , Durham, D. , Proceedings SPIE, 1992, 1672, 347-359.
6. Bogan, L. E. , US 4, 939, 229. For a general discussion on the role of quinonemethide intermediates in phenolic resins see: Encyclopeadia of Polymer Science and Technology, 10, 1-73(196