Packaging for microwave foods

The Microwave Processing of Foods

Volumn , Issue , 2005, Pages 192-217

  Schiffmann, R ^a  

^a R F Schiffmann Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84903662629     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1533/9781845690212.2.192     Document Type: Chapter

References (15)

1. Andreasen M. New Technologies to Improve Susceptor Efficiencies in Microwave Packages 1986, Optical Coating Laboratory Inc, Santa Rosa, California.
2. Bohrer T.H., Brown R.K. Packaging Techniques for Microwavable Foods. Handbook of Microwave Technology for Food Applications 2001, 402-416. Marcel Dekker, New York. A.K. Datta, R.C. Anantheswaran (Eds.).
3. Habeger C.C. Microwave interactive thin films. Microwave World 1997, 18(2):8-22.
4. Hagino J. Wrapping device 1998, US Patent No. 5,839,832.
5. Reefer R.M. Microwave heating package and method 1987, US Patent No. 4,656,325.
6. Reefer R.M. Container for microwave heating including means for modifying microwave heating distribution and method of using same 1989, US Patent No. 4,818,568.
7. Keller K. Ventable microwave-safe food package 1999, European Patent No. PCT/CH98/00546 (US Patent No. 6,607,764, 2003).
8. Lingle R. Pouches stand up to retorting. Packaging World 2003, 51-52. July.
9. Pawlowski T.D., Brown R.K. Sleeve for crisping and browning of foods in a microwave oven and package and method utilizing same 1988, US Patent No. 4,775,771.
10. Proffit P.J.G. Processing and Packaging of Heat Preserved Foods 1991, Blackie and Son, Glasgow and London, Chapter 7. J.A.G. Rees, J. Bettison (Eds.).
11. Robertson G. Food Packaging 1993, 121. Marcel Dekker, New York.
12. Schiffmann R.F. Hazards of microwave heating. Microwave Foods '88 1988, The Packaging Group.
13. Schiffmann R.F. Microwave foods: basic design considerations. TAPPI Journal 1990, 73(3):209-212.
14. Schiffmann R.F., Sacharow S. Microwave Packaging 1992, 104-106. Pira International, Leatherhead, UK, 111, 118, 123.
15. Walters G., et al. Multilayer fused microwave conductive structure 1996, US Patent No. 5,530,231.