Design for disassembly for remanufacturing: Methodology and technology

Procedia CIRP

Volumn 15, Issue , 2014, Pages 407-412

  Soh, S L ^a   Ong, S K ^a   Nee, A Y C ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Disassembly; High value cores; Remanufacturing

Indexed keywords

ECODESIGN; PRODUCT DESIGN;

CONCEPTUAL FRAMEWORKS; DISASSEMBLY; DISASSEMBLY PROCESS; HIGH VALUE CORES; LIFE CYCLE ENGINEERING; MODULAR MODELLING; REMANUFACTURING; SEQUENCE PLANNING;

LIFE CYCLE;

EID: 84903631010     PISSN: None     EISSN: 22128271     Source Type: Conference Proceeding    
DOI: 10.1016/j.procir.2014.06.053     Document Type: Conference Paper

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