Temperature changes of copper nanoparticle ink during flash light sintering

Journal of Materials Processing Technology

Volumn 214, Issue 11, 2014, Pages 2730-2738

  Park, Sung Hyeon ^a   Chung, Wan Ho ^a   Kim, Hak Sung ^a  

^a Hanyang University   (South Korea)

Author keywords

Copper; Flash light sintering; Flexible substrate; In situ temperature measuring system; Nano ink

Indexed keywords

BRIDGE CIRCUITS; COPPER; HEAT TRANSFER; IRRADIATION; LIGHT; METAL NANOPARTICLES; NEGATIVE IMPEDANCE CONVERTERS; OPERATIONAL AMPLIFIERS; POLYIMIDES; SUBSTRATES; TEMPERATURE; TEMPERATURE CONTROL; THERMOCOUPLES; AMPLIFIERS (ELECTRONIC); NANOPARTICLES; SINTERING;

ANALYTICAL CALCULATION; FLASH LIGHT IRRADIATIONS; FLEXIBLE SUBSTRATE; IN-SITU TEMPERATURE; MEASURED TEMPERATURES; NANO-INK; TEMPERATURE CALCULATION; WHEATSTONE BRIDGE CIRCUITS;

SINTERING; SUBSTRATES;

EID: 84903555111     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2014.06.007     Document Type: Article

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