An evaluation of thermal lags of fast-scan microchip DSC with polymer film samples

Thermochimica Acta

Volumn 589, Issue , 2014, Pages 262-269

  Toda, Akihiko ^a   Konishi, Misuzu ^b  

^a HIROSHIMA UNIVERSITY   (Japan)

^b Mettler Toledo KK   (Japan)

Author keywords

Fast scan DSC; Melting kinetics; Polyethylene; Thermal lag; Tin

Indexed keywords

DYE-SENSITIZED SOLAR CELLS; FILM THICKNESS; HEATING RATE; MICROPROCESSOR CHIPS; POLYETHYLENES; POLYMER FILMS; SENSORS; THERMAL GRADIENTS; THICK FILMS; TIN;

FAST-SCAN DSC; FITTING PARAMETERS; MELTING KINETICS; MODEL OF HEAT TRANSFERS; NUMERICAL CALCULATION; QUANTITATIVE EVALUATION; THERMAL LAG; THICKNESS DIRECTION;

THIN FILMS;

EID: 84902652958     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2014.05.038     Document Type: Article

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