Influence of Cu joining partner in transient liquid phase bonding

2012 4th Electronic System-Integration Technology Conference, ESTC 2012

Volumn , Issue , 2012, Pages

  Brem, Franziska ^a   Liu, Chunlei ^a   Raik, Déborah ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; GRAIN GROWTH; JOINING; SOLDERING; SOLDERING ALLOYS; TIN;

BONDING TECHNOLOGY; ELECTRONIC ASSEMBLIES; GRAIN MORPHOLOGIES; JOINING PROCESS; JOINT QUALITY; PHASE FORMATIONS; POWER ELECTRONIC PACKAGING; TRANSIENT LIQUID PHASE BONDING;

COPPER COMPOUNDS;

EID: 84902520259     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2012.6542135     Document Type: Conference Paper

References (8)

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3. Cook, G.O. and Sorensen, CD., "Overview of transient liquid phase and partial transient liquid phase bonding", J. Mater Sci., Vol. 46 (2011), pp. 5305-5323.
4. Humpston, G. et al., "Diffusion soldering for electronics manufacturing", Endeavour, Vol. 18, No. 2 (1994), pp. 55-60.
5. Guth, K. et al., "New assembly and interconnects beyond sintering methods", PCIM, Nuremberg/ Germany, 2010.
6. Guth, K. et al., "New assembly and interconnect technologies for power modules", CIPS, Nuremberg/Germany, 2012, March, Paper 10.1.
7. Shim, J.-H., et al, "Metallkde.", Vol. 87 (1996) pp. 205-212
8. 3Sn", Microelectronics Reliability, Vol. 51 (2011), pp. 837-846.