Copper interconnects for ceramic substrates and packages

Ceramic Interconnect Technology Handbook

Volumn , Issue , 2007, Pages 327-359

  Krum, Al ^a  

^a NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84902154626     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Chapter

References (27)

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