Thermal-aware high-frequency characterization of large-scale through-silicon-via structures

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 6, 2014, Pages 1015-1025

  Lu, Tianjian ^a   Jin, Jian Ming ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Domain decomposition; electrical thermal co simulation; finite element method (FEM); silicon interposer; through silicon via (TSV); TSV daisy chain.

Indexed keywords

CHAINS; DOMAIN DECOMPOSITION METHODS; FINITE ELEMENT METHOD; SILICON;

COSIMULATION; ELECTRICAL BEHAVIORS; HIGH POWER DENSITY; HIGH-FREQUENCY CHARACTERIZATION; MULTIPLE PROCESSORS; SILICON INTERPOSERS; THROUGH-SILICON-VIA; THROUGH-SILICON-VIA (TSV);

THERMAL CONDUCTIVITY;

EID: 84902148968     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2014.2312136     Document Type: Article

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