Encapsulation of copper-based phase change materials for high temperature thermal energy storage

Solar Energy Materials and Solar Cells

Volumn 128, Issue , 2014, Pages 131-137

  Zhang, Guocai ^a,b,c   Li, Jianqiang ^b   Chen, Yunfa ^c   Xiang, Heng ^d   Ma, Bingqian ^d   Xu, Zhe ^b   Ma, Xiaoguang ^d  

^a INSTITUTE OF PROCESS ENGINEERING   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

^c UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^d CHINA UNIVERSITY OF GEOSCIENCES   (China)

Author keywords

Charge discharge cycle; Chromium nickel layer; Copper; Electroplating; Encapsulation; Phase change materials

Indexed keywords

CHROMIUM; COPPER; ELECTROPLATING; ENCAPSULATION; HEAT STORAGE; LATENT HEAT; LIQUID METALS; NICKEL; PHASE CHANGE MATERIALS;

CHARGE-DISCHARGE CYCLE; CHROMIUM-NICKEL LAYER; HIGH TEMPERATURE PHASE CHANGE MATERIALS; HIGH TEMPERATURE THERMAL ENERGY STORAGES; HIGH-TEMPERATURE LIQUIDS; LATENT HEAT STORAGE SYSTEM; SOLAR THERMAL POWER GENERATION; ULTRAHIGH-THERMAL-CONDUCTIVITY;

THERMAL CONDUCTIVITY;

EID: 84902002250     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2014.05.012     Document Type: Article

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