Effect of incident angle on thin film growth: A molecular dynamics simulation study

Thin Solid Films

Volumn 544, Issue , 2013, Pages 496-499

  Cao, Yongzhi ^a   Zhang, Junjie ^a   Wu, Chao ^a   Yu, Fuli ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Incident angle; Microstructure; Molecular dynamics; Physical vapor deposition

Indexed keywords

ALUMINUM; COPPER; DEPOSITION; FILM GROWTH; MICROSTRUCTURE; MOLECULAR DYNAMICS; PHYSICAL VAPOR DEPOSITION; VAPOR DEPOSITION;

DYNAMICS SIMULATION; INCIDENT ANGLES; INCIDENT ENERGY; INTERNAL MICROSTRUCTURE; LATTICE STRUCTURES; LAYER BY LAYER; MOLECULAR DYNAMICS SIMULATIONS; TWIN BOUNDARIES;

THIN FILMS;

EID: 84901837125     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2013.01.067     Document Type: Conference Paper

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