메뉴 건너뛰기




Volumn 6, Issue 2, 2014, Pages 1047-1052

Investigating the influence of electroplating layer thickness on the tensile strength for fused deposition processed abs thermoplastics

Author keywords

ABS; CAD; Electroplating; FDM; RP

Indexed keywords


EID: 84900427180     PISSN: 23198613     EISSN: 09754024     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (22)

References (13)
  • 1
    • 84897569003 scopus 로고    scopus 로고
    • Effects of Electroplating on the Mechanical Properties of Injection Molded Thermoplastics
    • DOI: 10.1007/s12588-013-9056-6, Nov.
    • Mithun V Kulkarni, K. Elangovan and K. Hemachandra Reddy, "Effects of Electroplating on the Mechanical Properties of Injection Molded Thermoplastics," International Journal of Plastics Technology, DOI: 10.1007/s12588-013-9056-6, Nov. 2013.
    • (2013) International Journal of Plastics Technology
    • Kulkarni, M.V.1    Elangovan, K.2    Hemachandra Reddy, K.3
  • 2
    • 84900440575 scopus 로고    scopus 로고
    • Use of Fused Deposition Modeling Process in Investment Precision Casting and Risk of Using Selective Laser Sintering Process
    • M. Sivadasan, N.K Singh and Anoop Kumar Sood, "Use of Fused Deposition Modeling Process in Investment Precision Casting and Risk of Using Selective Laser Sintering Process," International Journal of Applied Research in Mechanical Engineering, 2(1), 2012, pp. 1-5.
    • (2012) International Journal of Applied Research in Mechanical Engineering , vol.2 , Issue.1 , pp. 1-5
    • Sivadasan, M.1    Singh, N.K.2    Sood, A.K.3
  • 3
    • 84900403482 scopus 로고
    • Investment Casting Hand Book.Investment Casting Institute,Illinois
    • Investment Casting Hand Book.Investment Casting Institute,Illinois:1968, pg 156-158.
    • (1968) , pp. 156-158
  • 4
    • 69549116138 scopus 로고    scopus 로고
    • Parametric Appraisal of Mechanical Property of Fused Deposition Modeling Processed Parts
    • Anoop Kumar Sood, R.K. Ohdar and S.S. Mahapatra, "Parametric Appraisal of Mechanical Property of Fused Deposition Modeling Processed Parts," Materials and Design 31, 2010, pp. 287-295.
    • (2010) Materials and Design , vol.31 , pp. 287-295
    • Sood, A.K.1    Ohdar, R.K.2    Mahapatra, S.S.3
  • 5
    • 84967531123 scopus 로고    scopus 로고
    • Rapid Prototyping: Principles and Applications
    • Singapore
    • C. K. Chua, K. F. Leong and C. S. Lim, "Rapid Prototyping: Principles and Applications," World Scientific Publishing, Singapore, 2003, pp. 420 .
    • (2003) World Scientific Publishing , pp. 420
    • Chua, C.K.1    Leong, K.F.2    Lim, C.S.3
  • 6
    • 9444264261 scopus 로고    scopus 로고
    • Effects of Electroplating on the Mechanical Properties of Stereolithography and Laser Sintered Parts
    • N. Saleh, N. Hopkinson, R. J. M. Hague and S. Wise, "Effects of Electroplating on the Mechanical Properties of Stereolithography and Laser Sintered Parts," Rapid Prototyping Journal., 10(5), 2004, pp.305-315.
    • (2004) Rapid Prototyping Journal. , vol.10 , Issue.5 , pp. 305-315
    • Saleh, N.1    Hopkinson, N.2    Hague, R.J.M.3    Wise, S.4
  • 9
    • 84900422166 scopus 로고    scopus 로고
    • (accessed on 08-02-2014).
    • http://nptel.ac.in/courses/Webcourse-contents/IIT-Delhi/Computer%20Aided%20Design%20&%20ManufacturingII/Module%20G/Module%20G(4)p3.htm (accessed on 08-02-2014).
  • 11
    • 0042524653 scopus 로고    scopus 로고
    • Surface Modification and Characterization of Photodefinable Epoxy / Copper System
    • J.Ge, M.P.K Turunen and J.K.Kivilahti, "Surface Modification and Characterization of Photodefinable Epoxy / Copper System. Thin Solid Films", vol 440, 2003, pp. 198-208.
    • (2003) Thin Solid Films , vol.440 , pp. 198-208
    • Ge, J.1    Turunen, M.P.K.2    Kivilahti, J.K.3
  • 12
    • 1242287618 scopus 로고    scopus 로고
    • Influence of Chemical Pre-treatment of Epoxy Polymer on the Adhesion Strength of Electrochemically Deposited Cu'
    • S.Sam, V.Alfons, S.Etienne and V.C.Andre, "Influence of Chemical Pre-treatment of Epoxy Polymer on the Adhesion Strength of Electrochemically Deposited Cu', Journal of Electro Chemical Society," vol 151(2), 2004, pp. 133-146.
    • (2004) Journal of Electro Chemical Society , vol.151 , Issue.2 , pp. 133-146
    • Sam, S.1    Alfons, V.2    Etienne, S.3    Andre, V.C.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.