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Volumn 53, Issue 20, 2014, Pages 5175-5178

Interpenetration as a mechanism for negative thermal expansion in the metal-organic framework Cu3(btb)2 (MOF-14)

Author keywords

mechanical properties; metal organic frameworks; negative thermal expansion; structural dynamics; structure elucidation

Indexed keywords

CRYSTALLINE MATERIALS; JAVA PROGRAMMING LANGUAGE; LOW POWER ELECTRONICS; MECHANICAL PROPERTIES; METALS; STRUCTURAL DYNAMICS; THERMAL EXPANSION;

EID: 84899996381     PISSN: 14337851     EISSN: 15213773     Source Type: Journal    
DOI: 10.1002/anie.201311055     Document Type: Article
Times cited : (66)

References (46)
  • 3
    • 84864522410 scopus 로고    scopus 로고
    • C. Lind, Materials 2012, 5, 1125-1154.
    • (2012) Materials , vol.5 , pp. 1125-1154
    • Lind, C.1
  • 16
    • 44649183962 scopus 로고    scopus 로고
    • Angew. Chem. Int. Ed. 2008, 47, 1396-1399.
    • (2008) Angew. Chem. Int. Ed. , vol.47 , pp. 1396-1399
  • 23
    • 84877299103 scopus 로고    scopus 로고
    • Angew. Chem. Int. Ed. 2013, 52, 5266-5270
    • (2013) Angew. Chem. Int. Ed. , vol.52 , pp. 5266-5270
  • 29
    • 57349199486 scopus 로고    scopus 로고
    • Angew. Chem. Int. Ed. 2008, 47, 8929-8932.
    • (2008) Angew. Chem. Int. Ed. , vol.47 , pp. 8929-8932
  • 31
  • 35
    • 34250695911 scopus 로고    scopus 로고
    • Angew. Chem. Int. Ed. 2007, 46, 4496-4499
    • (2007) Angew. Chem. Int. Ed. , vol.46 , pp. 4496-4499


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.