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Volumn , Issue , 2005, Pages

Novel packaging of parallel-optical interconnects for high-end servers

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES;

EID: 84899138185     PISSN: None     EISSN: 21622701     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (6)
  • 3
    • 84899144495 scopus 로고    scopus 로고
    • Products: HFBR-779B/HFBR-789 and HFBR-772B/HFBR-782B, (Agilent Technologies, Inc.)
    • Products: HFBR-779B/HFBR-789 and HFBR-772B/HFBR-782B, (Agilent Technologies, Inc.), http://www.agilent.com/view/paralleloptics
  • 4
    • 84899153783 scopus 로고    scopus 로고
    • Products: V23832T 2331M101 and V23832R 321M101, (Infineon Technologies, Inc.)
    • Products: V23832T 2331M101 and V23832R 321M101, (Infineon Technologies, Inc.), http://www.infineon.com/fiberoptics
  • 5
    • 4544325227 scopus 로고    scopus 로고
    • MAUI: Enabling Fiber-to-the- Processor with Parallel Multiwavelength Optical Interconnects
    • B. E. Lemoff, M. E. Ali, G. Panotopoulos, G. M. Flower, B. Madhavan, A. F. J. Levi, D. W. Dolfi, "MAUI: Enabling Fiber-to-the- Processor with Parallel Multiwavelength Optical Interconnects," JLT 22, 2043-2054 (2004).
    • (2004) JLT , vol.22 , pp. 2043-2054
    • Lemoff, B.E.1    Ali, M.E.2    Panotopoulos, G.3    Flower, G.M.4    Madhavan, B.5    Levi, A.F.J.6    Dolfi, D.W.7
  • 6
    • 84887329573 scopus 로고    scopus 로고
    • Chip-mounted enclosure
    • US patent 6 351 027 B1, Feb. 26
    • K. Giboney and J. Simon, "Chip-mounted enclosure," US patent 6 351 027 B1, Feb. 26, 2002.
    • (2002)
    • Giboney, K.1    Simon, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.