Enhanced thermal properties of epoxy composites by using hyperbranched aromatic polyamide grafted silicon carbide whiskers

Macromolecular Research

Volumn 22, Issue 4, 2014, Pages 405-411

  Yuan, Zhengkai ^a   Yu, Jinhong ^a,b   Rao, Baolin ^a   Bai, Hua ^b   Jiang, Nan ^b   Gao, Jian ^a   Lu, Shaorong ^a  

^a GUILIN UNIVERSITY OF TECHNOLOGY   (China)

^b NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING   (China)

Author keywords

epoxy composites; hyperbranched aromatic polyamide; silicon carbide (SiC) whiskers; thermal properties

Indexed keywords

AROMATIC COMPOUNDS; AROMATIZATION; CRYSTAL WHISKERS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS; GLASS TRANSITION; GRAFTING (CHEMICAL); MECHANICAL PROPERTIES; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; SILICON CARBIDE; THERMODYNAMIC PROPERTIES; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

AROMATIC POLYAMIDES; DYNAMICAL MECHANICAL PROPERTIES; EPOXY COMPOSITE; INTERFACIAL ADHESIONS; SILICON CARBIDE WHISKER; SILICON CARBIDES (SIC); SOLUTION POLYMERIZATION; THERMAL GRAVIMETRIC ANALYSES (TGA);

THERMAL CONDUCTIVITY;

EID: 84899100537     PISSN: 15985032     EISSN: 20927673     Source Type: Journal    
DOI: 10.1007/s13233-014-2049-2     Document Type: Article

References (31)

1. J. K. Herman Teo, C. L. Toh, and X. Lu, Polymer, 52, 1975 (2011).
2. M. Kozako, Y. Okazaki, M. Hikita, and T. Tanaka, in Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on, Potsdam, DOI:10.1109/ICSD.2010.5568250 (2010).
3. W. Kim, J. W. Bae, I. D. Choi, and Y. S. Kim, Polym. Eng. Sci., 39, 756 (1999).
4. C. Y. Hsieh and S. L. Chung, J. Appl. Polym. Sci., 102, 4734 (2006).
5. K. Sato, H. Horibe, T. Shirai, Y. Hotta, H. Nakano, H. Nagai, K. Mitsuishi, and K. Watari, J. Mater. Chem., 20, 2749 (2010).
6. K. Yung and H. Liem, J. Appl. Polym. Sci., 106, 3587 (2007).
7. D. Golberg, Y. Bando, Y. Huang, T. Terao, M. Mitome, C. Tang, and C. Zhi, ACS Nano, 4, 2979 (2010).
8. T. Zhou, X. Wang, G. Mingyuan, and X. Liu, Polymer, 49, 4666 (2008).
9. T. Zhou, X. Wang, X. Liu, and D. Xiong, Carbon, 48, 1171 (2010).
10. K. Yang and M. Gu, Compos. Part A: Appl. Sci. Manuf., 41, 215 (2010).
11. T. Zhou, X. Wang, H. Zhu, and T. Wang, Compos. Part A: Appl. Sci. Manuf., 40, 1792 (2009).
12. T. Zhou, M. Gu, Y. Jin, and J. Wang, Polymer, 46, 6174 (2005).
13. T. Zhou, M. Gu, Y. Jin, and J. Wang, Polymer, 46, 6216 (2005).
14. M. Bhattacharya and A. K. Bhowmick, Polymer, 49, 4808 (2008).
15. A. Karul, K. T. Tan, C. C. White, D. L. Hunston, S. T. Marshall, B. Akgun, S. K. Satija, C. L. Soles, and B. D. Vogt, Polymer, 50, 3234 (2009).
16. A. Korzhenko, M. Tabellout, and J. R. Emery, Polymer, 40, 7187 (1999).
17. Y. Lei, Z. Tang, L. Zhu, B. Guo, and D. Jia, Polymer, 52, 1337 (2011).
18. F. Tao, B. Nysten, A.-C. Baudouin, J.-M. Thomassin, D. Vuluga, C. Detrembleur, and C. Bailly, Polymer, 52, 4798 (2011).
19. M. Wong, M. Paramsothy, X. J. Xu, Y. Ren, S. Li, and K. Liao, Polymer, 44, 7757 (2003).
20. S.-J. Chang, W.-S. Liao, C.-J. Ciou, J.-T. Lee, and C.-C. Li, J. Colloid Interface Sci., 329, 300 (2009).
21. T. Zhou, J.-W. Zha, R.-Y. Cui, B.-H. Fan, J.-K. Yuan, and Z.-M. Dang, ACS Appl. Mater. Interfaces, 3, 2184 (2011).
22. J. Yu, X. Huang, C. Wu, X. Wu, G. Wang, and P. Jiang, Polymer, 53, 471 (2012).
23. J. Yu, X. Huang, L. Wang, P. Peng, C. Wu, X. Wu, and P. Jiang, Polym. Chem., 2, 1380 (2011).
24. R. Qian, J. Yu, L. Xie, Y. Li, and P. Jiang, Polym. Adv. Technol., 24, 348 (2013).
25. T. Coleman and Y. Li, SIAM J. Optim., 6, 418 (1996).
26. H. Im and J. Kim, J. Mater. Sci., 47, 6025 (2012).
27. Y. Hu, J. Shen, N. Li, H. Ma, M. Shi, B. Yan, W. Huang, W. Wang, and M. Ye, Compos. Sci. Technol., 70, 2176 (2010).
28. S. S. Al-Juaid, E. H. El-Mossalamy, H. M. Arafa, A. A. Al-Ghamdi, A. M. A. Daiem, and F. El-Tantawy, J. Appl. Polym. Sci., 121, 3604 (2011).
29. N. Tagami, M. Hyuga, Y. Ohki, T. Tanaka, T. Imai, M. Harada, and M. Ochi, IEEE Trans. Dielectr. Electr. Insul., 17, 214 (2010).
30. S. H. Kim, W. I. Lee, and J. M. Park, Carbon, 47, 2699 (2009).
31. N. Yousefi, M. M. Gudarzi, Q. Zheng, S. H. Aboutalebi, F. Sharif, and J.-K. Kim, J. Mater. Chem., 22, 12709 (2012).