Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication

Science China Technological Sciences

Volumn 57, Issue 4, 2014, Pages 734-737

  Xu, Ke ^a,b   Tian, Xiaojun ^a   Yu, Haibo ^a   Yang, Yang ^a   Zhou, Lei ^a   Liu, Lianqing ^a  

^a SHENYANG INSTITUTE OF AUTOMATION   (China)

^b SHENYANG JIANZHU UNIVERSITY   (China)

Author keywords

Cu CuO nanowires; floating potential di electrophoresis; large scale assembly

Indexed keywords

COMPUTER SOFTWARE; ELECTROPHORESIS; FABRICATION; NANOELECTRONICS; NANOWIRES; REFRACTORY METAL COMPOUNDS; THERMOELECTRIC EQUIPMENT;

CHIP FABRICATION; DRAIN ELECTRODES; ELECTRICAL POTENTIAL; ELECTRICAL POTENTIAL DISTRIBUTION; ELECTRODE PAIRS; ELECTROPHORESIS FORCES; FLOATING POTENTIALS; NANOELECTRONIC DEVICES;

ELECTRODES;

EID: 84899002337     PISSN: 16747321     EISSN: 18691900     Source Type: Journal    
DOI: 10.1007/s11431-014-5493-5     Document Type: Article

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