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Volumn , Issue , 2014, Pages 963-966

Fabrication of high aspect ratio insulating nozzle using glass reflow process and its electrohydrodynamic printing characteristics

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROHYDRODYNAMICS; GLASS; MEMS; PRINTING; SILVER;

EID: 84898969633     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2014.6765803     Document Type: Conference Paper
Times cited : (12)

References (5)
  • 2
    • 80053905510 scopus 로고    scopus 로고
    • Multi-nozzle electrohydrodynamic inkjet printing of silver colloidal solution for the fabrication of electrically functional microstructures
    • A. Khan, K. Rahman, M.-T. Hyun, D.-S. Kim, K.-H. Choi, "Multi-nozzle electrohydrodynamic inkjet printing of silver colloidal solution for the fabrication of electrically functional microstructures", Appl. Phys. A, vol. 104, no. 4, pp.1113-1120, 2011.
    • (2011) Appl. Phys. A , vol.104 , Issue.4 , pp. 1113-1120
    • Khan, A.1    Rahman, K.2    Hyun, M.-T.3    Kim, D.-S.4    Choi, K.-H.5
  • 3
    • 57849113532 scopus 로고    scopus 로고
    • Design and evaluation of a silicon based multi-nozzle for addressable jetting using a controlled flow rate in electrohydrodynamic jet printing
    • J.-S. Lee,S.-Y. Kim, Y.-J. Kim, J. Park,Y. Kim,J. Hwang, Y.-J. Kim, "Design and evaluation of a silicon based multi-nozzle for addressable jetting using a controlled flow rate in electrohydrodynamic jet printing", Appl. Phys. Lett., vol. 93, pp. 243114 (1-3), 2008.
    • (2008) Appl. Phys. Lett. , vol.93 , Issue.1-3 , pp. 243114
    • Lees.-Y. Kim, J.-S.1    Kim, Y.-J.2    Park, Y.3    Kim, J.4    Hwang, J.5    Kim, Y.-J.6
  • 4
    • 84875426547 scopus 로고    scopus 로고
    • Multi nozzle electrohydrodynamic inkjet printing head by batch fabrication
    • K. I. Lee, B. Lim, H. Lee, S. H. Kim, C. S. Lee, J. W. Cho, Y. Hong , "Multi nozzle electrohydrodynamic inkjet printing head by batch fabrication", Proc. MEMS 2013, pp. 1165-1168, 2013.
    • (2013) Proc. MEMS , vol.2013 , pp. 1165-1168
    • Lee, K.I.1    Lim, B.2    Lee, H.3    Kim, S.H.4    Lee, C.S.5    Cho, J.W.6    Hong, Y.7
  • 5
    • 84875431832 scopus 로고    scopus 로고
    • Wafer level packaging for RF MEMS devices using void free copper filled through glass via
    • J.-Y. Lee, S.-W. Lee, S.-K. Lee, J.-H. Park , "Wafer level packaging for RF MEMS devices using void free copper filled through glass via", Proc. MEMS 2013, pp. 773-776, 2013.
    • (2013) Proc. MEMS , vol.2013 , pp. 773-776
    • Lee, J.-Y.1    Lee, S.-W.2    Lee, S.-K.3    Park, J.-H.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.