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Volumn , Issue , 2013, Pages 216-221

Generation of electro-thermal models of integrated power electronics modules using a novel synthesis technique

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC DRIVES;

EID: 84898953732     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2013.6675200     Document Type: Conference Paper
Times cited : (17)

References (15)
  • 4
    • 42449124172 scopus 로고    scopus 로고
    • Parasitic parameter extraction and loss analysis of a 3kW MOSFET hybrid integrated power electronics module (IPEM) for three-phase motor driver
    • Jeju, South Korea June 18-22
    • L. Zhang, X. Yang, Y. Pei, Z. Wang, "Parasitic parameter extraction and loss analysis of a 3kW MOSFET hybrid integrated power electronics module (IPEM) for three-phase motor driver", in Proceedings of Power Electronics Specialists Conference (PESC), Jeju, South Korea, June 18-22, 2006, pp. 1-7
    • (2006) Proceedings of Power Electronics Specialists Conference (PESC) , pp. 1-7
    • Zhang, L.1    Yang, X.2    Pei, Y.3    Wang, Z.4
  • 7
    • 0033338528 scopus 로고    scopus 로고
    • A time-domain method for the analysis of thermal impedance response preserving the convolution form
    • M. Carmona, S. Marco, J. Palacin, J. Samitier, "A time-domain method for the analysis of thermal impedance response preserving the convolution form", IEEE Transaction on Components and Packaging Technology, 1999, vol. 22, n. 2, pp. 238-244
    • (1999) IEEE Transaction on Components and Packaging Technology , vol.22 , Issue.2 , pp. 238-244
    • Carmona, M.1    Marco, S.2    Palacin, J.3    Samitier, J.4
  • 8
    • 42549089165 scopus 로고    scopus 로고
    • Junction temperature elevation as a result of thermal cross coupling in a multi-device power electronic module
    • Dresden, German September 5-7
    • M. J. Whitehead, C. M. Johnson, "Junction Temperature Elevation as a Result of Thermal Cross Coupling in a Multi-Device Power Electronic Module", in Proceeding of Electronics System integration Technology Conference, Dresden, German, September 5-7, 2006, pp. 1218-1223
    • (2006) Proceeding of Electronics System Integration Technology Conference , pp. 1218-1223
    • Whitehead, M.J.1    Johnson, C.M.2
  • 10
    • 84899015720 scopus 로고    scopus 로고
    • 1, May
    • Matlab 6. 1, May 2001
    • (2001) Matlab 6
  • 13
    • 33746903187 scopus 로고    scopus 로고
    • version 4. 3, COMSOL, Inc
    • COMSOL Multiphysics, version 4. 3, COMSOL, Inc
    • COMSOL Multiphysics


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.