Thermal stability and conductivity of hot-pressed Si3N 4-graphene composites

Journal of Thermal Analysis and Calorimetry

Volumn 116, Issue 1, 2014, Pages 321-328

  Rutkowski, P ^a   Stobierski, L ^a   Gorny G ^a  

^a AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

Graphene; Microstructure; Silicon nitride; Thermal conductivity; Thermal stability

Indexed keywords

CERAMIC CUTTING TOOLS; CERAMIC MATRIX COMPOSITES; GRAPHENE; MICROSTRUCTURE; SILICON; SILICON NITRIDE; SINTERING; THERMODYNAMIC STABILITY;

A-CERAMICS; ALN; COMPOSITE MATRICES; FUTURE APPLICATIONS; GRAPHENE COMPOSITES; HIGH TEMPERATURE; SINTERING PROCESS; UNIAXIAL PRESSURES;

THERMAL CONDUCTIVITY;

EID: 84898777027     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-013-3565-6     Document Type: Article

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