Interface microstructures and bond formation in ultrasonic consolidation

18th Solid Freeform Fabrication Symposium, SFF 2007

Volumn , Issue , 2007, Pages 266-283

  Janaki Ram, G D ^a   Yang, Y ^a   Nylander, C ^b   Aydelotte, B ^b   Stucker, B E ^a   Adams, B L ^b  

^a Utah State University   (United States)

^b Department of Electrical and Computer Engineering   (United States)

Author keywords

Additive manufacturing; Bonding mechanism; Interface microstructures; Ultrasonic consolidation; Ultrasonic welding

Indexed keywords

3D PRINTERS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; ULTRASONIC WELDING; ULTRASONICS;

ADDITIVE MANUFACTURING; BONDING MECHANISM; INTERFACE MI-CROSTRUCTURE; MICRO-STRUCTURAL; MULTI MATERIALS; ORIENTATION IMAGING MICROSCOPY; ULTRASONIC BONDING; ULTRASONIC CONSOLIDATION;

CRYSTAL MICROSTRUCTURE;

EID: 84898454577     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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