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Volumn 57, Issue , 2014, Pages 120-121
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A heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
a a a a a a a a a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
DATA HANDLING;
FIELD PROGRAMMABLE GATE ARRAYS (FPGA);
DATA CONVERSION;
DATA CONVERTER;
DISCRETE DEVICES;
DIVERSE APPLICATIONS;
EXPONENTIAL GROWTH;
IO INTERFACES;
POWER EFFICIENT;
RECONFIGURABLE;
RECONFIGURABLE HARDWARE;
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EID: 84898079667
PISSN: 01936530
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSCC.2014.6757364 Document Type: Conference Paper |
Times cited : (13)
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References (6)
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