A 0.33nJ/b IEEE802.15.6/proprietary-MICS/ISM-band transceiver with scalable data-rate from 11kb/s to 4.5Mb/s for medical applications

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 57, Issue , 2014, Pages 170-171

  Vidojkovic, Maja ^a   Huang, Xiongchuan ^a   Wang, Xiaoyan ^a   Zhou, Cui ^a   Ba, Ao ^a   Lont, Maarten ^a   Liu, Yao Hong ^a   Harpe, Pieter ^b   Ding, Ming ^a   Busze, Ben ^a   Kiyani, Nauman ^a   Kanda, Kouichi ^c   Masui, Shoichi ^c   Philips, Kathleen ^a   De Groot, Harmke ^a  

^a HOLST CENTRE   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY EFFICIENCY; TRANSCEIVERS;

FSK MODULATION; HUMAN BODIES; LOW DATA RATES; LOW-POWER MODE; LOW-POWER TRANSCEIVER; SHADOWING EFFECTS; VITAL SIGN; WIRELESS NODES;

MEDICAL APPLICATIONS;

EID: 84898073240     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2014.6757386     Document Type: Conference Paper

References (6)

1. J. Pandey, et al., "A 90 μW MICS/ISM Band Transmitter with 22% Global Efficiency", IEEE RFIC Symposium, pp. 285-288, May 2010.
2. J. L. Bohorquez, et al., "A 350μW CMOS MSK Transmitter and 400μW OOK Super-Regenerative Receiver for Medical Implant Communications", IEEE J. Solid-State Circuits, vol. 44, no. 4, April 2009.
3. Y.H. Liu, et al., "A 1.9nJ/b 2.4GHz Multistandard (Bluetooth Low Energy/Zigbee/IEEE 802.15.6) Transceiver for Personal/Body-Area Networks", ISSCC Dig. Tech Papers, pp. 446-447, Feb. 2013.
4. P.D. Bradley, et, al., "An Ultra Low Power, High Performance Medical Implant Communication System (MICS) Transceiver for Implantable Devices", IEEE BioCAS, pp. 158-161, Dec. 2006.
5. V. Peiris, et al., "A 1V 433/868MHz 25kb/s-FSK 2kb/s-OOK RF Transceiver SoC in Standard Digital 0.18μm CMOS", ISSCC Dig. Tech Papers, pp. 258-259, Feb. 2005.
6. F. Carrara et al., "A 400-MHz CMOS Radio Front-End for Ultra Low-Power Medical Implantable Applications", IEEE ESSCIRC, pp. 232-235, Sept. 2009.