Influence regularity of trace O6 on SF6 decomposition characteristics and its mathematical amendment under partial discharge

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 21, Issue 1, 2014, Pages 105-115

  Tang, Ju ^a   Zeng, Fuping ^a   Zhang, Xiaoxing ^a   Pan, Jianyu ^a   Qiu, Yinjun ^b   Liu, Yan ^b   Yuan, Jingfan ^b  

^a CHONGQING UNIVERSITY   (China)

^b Hainan Power Company   (China)

Author keywords

decomposition characteristic; influence regularity; mathematical amendment.; Partial discharge

Indexed keywords

ATMOSPHERIC COMPOSITION; CARBON DIOXIDE; CHEMICAL ANALYSIS; PARTIAL DISCHARGES; SULFUR DIOXIDE; SULFUR HEXAFLUORIDE;

CHARACTERISTIC RATIO; DECOMPOSITION CHARACTERISTICS; ELECTRICAL EQUIPMENT; ENGINEERING APPLICATIONS; INFLUENCE REGULARITY; INTERNAL INSULATION; MATHEMATICAL AMENDMENT; VARIATION REGULARITY;

SF6 INSULATION;

EID: 84897730086     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2013.003795     Document Type: Article

References (25)

1. M. Istad and M. Runde, "Thirty-Six Years of Service Experience with a National Population of Gas-Insulated Substations," IEEE Trans. Power Delivery, Vol. 25, pp. 2448-2454, 2010.
2. K. Dreisbusch, H. G. Kranz and A. Schnettler, "Determination of a Failure Probability Prognosis based on PD-Diagnostics in GIS," IEEE Trans. Dielectr. Electr. Insul., Vol. 15, pp. 1707-1714, 2008.
3. C. Chang, C. S. Chang, J. Jin, T. Hoshino, M. Hanai and N. Kobayashi, "Source Classification of Partial Discharge for Gas Insulated Substation Using Waveshape Pattern Recognition," IEEE Trans. Dielectr. Electr. Insul., Vol. 12, pp. 374-386, 2005. (Pubitemid 40850576)
4. S. Rudd, S. D. J. McArthur and M. D. Judd, "A Generic Knowledgebased Approach to the Analysis of Partial Discharge Data," IEEE Trans. Dielectr. Electr. Insul., Vol. 17, pp. 149-156, 2010.
5. J. Tang, F. Liu, X. Zhang, Q. Meng and J. Zhou, "Partial Discharge Recognition through an Analysis of SF6 Decomposition Products Part 1: Decomposition Characteristics of SF6 under Four Different Partial Discharges," IEEE Trans. Dielectr. Electr. Insul., Vol. 19, pp. 29-36, 2012.
6. J. Tang, F. Liu, Q. Meng, X. Zhang and J. Tao, "Partial Discharge Recognition through an Analysis of SF6 Decomposition Products Part 2: Feature Extraction and Decision Tree-based Pattern Recognition," IEEE Trans. Dielectr. Electr. Insul., Vol. 19, pp. 37-44, 2012.
7. F.Y.Chu, "SF6 Decomposition in Gas Insulated Equipment," IEEE Trans. Electr. on of SF6 in a Negative Glow Corona Discharge," Physica Scripta, Vol. T53, pp. 9-29, 1994.
8. IEC60480-2004, "Guidelines for the Checking and Treatment of Sulfur Hexafluoride (SF6) Taken from Electrical Equipment and Specification for Its Re-use," 2004.
9. I. Sauers, "By-Product Formation in Spark Breakdown of SF6/O2 Mixtures," Plasma Chem. Plasma Processing, Vol. 8, pp. 247-262, 1988. (Pubitemid 18636158)
10. A. M. Casanovas and J. Casanovas, "Decomposition of High-pressure (400 kPa) SF6/CO2, SF6/CO, SF6/N2/CO2 and SF6/N2/CO Mixtures under Negative Insul., Vol. 21, pp. 693-725, 1986.
11. R. J. Van Brunt and M. C. Siddagangappa, "Identification of Corona Discharge-Induced SF6 Oxidation Mechanisms Using SF6/(18O2)/(H2 16O) and SF6/(16O2)/(H2 18O) Gas-Mixtures," Plasma Chem. Plasma Processing, Vol. 8, pp. 207-223, 1988.
12. R. J. Van Brunt and J. T. Herron, "Plasma Chemical-Model for Decomposite DC Coronas," J. Phys. D-Appl. Phys., Vol. 38, pp. 1556-1564, 2005.
13. A. M. Casanovas, I. Coll and J. Casanovas, "Decomposition Products from Negative and 50 Hz AC Corona Discharges in Compressed SF6 and SF6/N2 (10 : 90) Mixtures. Effect of Water Vapour Added to the Gas," J. Phys. D-Appl. Phys., Vol. 32, pp. 1681-1692, 1999.
14. A. M. Casanovas, J. Diaz and J. Casanovas, "Spark Decomposition of SF6, SF6/N2 (10 : 90 and 5 : 95) Mixtures in the Presence of Solid Additives (Polyethylene, Polypropylene or Teflon), Gaseous Additives (Methane, Ethylene, Octofluoropropane, Carbon Monoxide or Dioxide), Water or Oxygen," J. Phys. D-Appl. Phys., Vol. 35, pp. 2558-2569, Oct 21 2002. (Pubitemid 35327368)
15. L. G. Christophorou, J. K. Olthoff and R. J. Van Brunt, "Sulfur Hexafluoride and the Electric Power Industry," IEEE Electr. Insul. Mag., Vol. 13, No.5, pp. 20-24, 1997. (Pubitemid 127568066)
16. F. Y. Chu, "Gas Analysis as a Diagnostic Tool for Gas-Insulated Equipment," Gaseous Dielectrics V, Fifth Int'l. Sympos., pp. 219-227, 1987.
17. J. Diaz, A. M. Casanovas, C. Godard and J. Casanovas, "Chemical Decomposition of High Pressure SF6/N2 (5 : 95) Mixtures under Negative DC Corona Discharges," Gaseous Dielectrics IX, pp. 543-547, 2001.
18. J. Diaz, A. M. Casanovas, C. Godard and J. Casanovas, "Chemical Decomposition of High Pressure SF6/N2 (5 : 95) Mixtures under Negative DC Corona Discharges", Gaseous Dielectrics IX, pp. 543-547, 2001.
19. R. J. Van Brunt and J. T. Herron, "Fundamental Processes of SF6 Decomposition and Oxidation in Glow and Corona Discharges," IEEE Trans. Electr. Insul., Vol., Vol. 25, pp. 75-94, 1990. (Pubitemid 20688561)
20. R. J. Van Brunt, L. W. Sieck, I. Sauers and M. C. Siddagangappa, "Transfer of F-in the Reaction of SF6-with SOF4-Implications for SOF4 Production in Corona Discharges," Plasma Chem. Plasma Processing, Vol. 8, pp. 225-246, 1988.
21. J. M. Braun and F. Y. Chu, "Novel Low-Cost SF6 Arcing By-Product Detectors for Field Use in Gas-Insulated Switchgear," IEEE Trans. Power Delivery, Vol. 1, pp. 81-86, 1986. (Pubitemid 16596040)
22. I. C. Plumb and K. R. Ryan, "Gas-Phase Reactions of CF3 and CF2 with Atomic and Molecular Fluorine : Their Significance in Plasma-Etching," Plasma Chem. Plasma Processing, Vol. 6, pp. 11-25, 1986. (Pubitemid 16519173)
23. I. C. Plumb and K. R. Ryan, "A Model of the Chemical Processes Occurring in CF4/O2 Discharges Used in Plasma-Etching," Plasma Chem. Plasma Processing, Vol. 6, pp. 205-230, 1986.
24. K. R. Ryan and I. C. Plumb, "Gas-phase Reactions of CF2 with O( 3P) to Produce COF: Their Significance in Plasma Processing," Plasma Chem. Plasma Processing, Vol. 4, pp. 271-283, 1984. (Pubitemid 15453653)
25. J. H. Espenson, "Chemical kinetics and Reaction Mechanism," McGraw-Hill Companies, New York, Ch.6, 1995.