Thermal conductivities of electrospun polyimide-mesophase pitch nanofibers and mats

Polymer Engineering and Science

Volumn 54, Issue 4, 2014, Pages 977-983

  Yan, Han ^a   Mahanta, Nayandeep K ^b   Majerus, Laurent J ^b   Abramson, Alexis R ^b   Cakmak, Miko ^a  

^a The University of Akron   (United States)

^b Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POLYIMIDES; THERMAL CONDUCTIVITY; WEAVING;

COMPOSITE NANOFIBERS; ELECTROSPINNING PROCESS; ELECTROSPUNS; FLEXIBLE ELECTRONICS DEVICE; IN-PLANE CONDUCTIVITY; MESOPHASE PITCH; NANOFIBER MATS; NONWOVEN MATS; OUT-OF-PLANE; THROUGH-THICKNESS;

NANOFIBERS;

EID: 84897584826     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.23638     Document Type: Article

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