Design of novel multilayer microwave coupled-line structures using thick-film technology

2001 31st European Microwave Conference, EuMC 2001

Volumn , Issue , 2001, Pages

  Tian, Zhengrong ^a   Free, Charles ^a   Barnwell, Peter ^b   Wood, James ^b   Aitchison, Colin ^c  

^a MIDDLESEX UNIVERSITY   (United Kingdom)

^b Heraeus Circuit Materials Division   (United States)

^c UNIVERSITY OF SURREY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ELECTRIC LINES;

CONDUCTOR PATTERNS; ETCHING TECHNIQUE; MICROWAVE PERFORMANCE; MULTILAYER STRUCTURES; MULTIPLE LAYERS; SINGLE-LAYER STRUCTURE; THICK FILM TECHNIQUE; THICK-FILM TECHNOLOGY;

MULTILAYERS;

EID: 84897562043     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.2001.339144     Document Type: Conference Paper

References (3)

1. Free, C. E., Barnwell, P. G., Aitchison, C. S. 'A new thick-film material for mm-wave MCM and microwave devices', Proc. 31st Int Microelectronics Symposium, San Diego, USA, Nov 1998
2. Free, C. E., C. S. Aitchison, "Excess Phase in Microstrip DC Blocks," Electronics Letters, Vol. 20, Oct. 1984, pp. 892-893.
3. G. Matthaei, L. Young and E. M. T. Jones, Microwave Filters, Impedance-Matching Networks, and Coupling Structures, Artech House, Dedham, MA, 1990.