Novel active integrated antenna configuration using multi-layered teflon substrate and solder bump interconnection for large scale array

2002 32nd European Microwave Conference, EuMC 2002

Volumn , Issue , 2002, Pages

  Seki, Tomohiro ^a   Cho, Keizo ^a   Mizuno, Hideki ^b  

^a NTT Corporation   (Japan)

^b NTT DOCOMO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA FEEDERS; POLYTETRAFLUOROETHYLENES;

ACTIVE INTEGRATED ANTENNA; CONNECTION METHOD; LARGE-SCALE ARRAYS; MULTI-LAYERED; PROTOTYPE ANTENNAS; SOLDER BUMP; TEFLON SUBSTRATE; THROUGH HOLE;

ANTENNAS;

EID: 84897492596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.2002.339357     Document Type: Conference Paper

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