Energy and bond strength development during ultrasonic consolidation

Journal of Materials Processing Technology

Volumn 214, Issue 8, 2014, Pages 1665-1672

  Kelly, Gregory S ^a   Just Jr , M Scott ^a   Advani, Suresh G ^a   Gillespie Jr , John W ^a  

^a UNIVERSITY OF DELAWARE   (United States)

Author keywords

Aluminum; Bond strength; Infrared thermography; Ultrasonic consolidation

Indexed keywords

ALUMINUM; BOND STRENGTH (MATERIALS); THERMOGRAPHY (IMAGING); ULTRASONICS;

BONDING MECHANISM; OPTIMUM PROCESSING; PROCESS PARAMETERS; PROCESSING TEMPERATURE; STRENGTH DEVELOPMENT; THERMAL SOFTENING; ULTRASONIC CONSOLIDATION; VOLUMETRIC HEAT GENERATION;

WELDS;

EID: 84897434358     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2014.03.010     Document Type: Article

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