Accommodating thickness in origami-based deployable arrays

Proceedings of the ASME Design Engineering Technical Conference

Volumn 6 B, Issue , 2013, Pages

  Zirbel, Shannon A ^a   Magleby, Spencer P ^a   Howell, Larry L ^a   Lang, Robert J ^b   Thomson, Mark W ^c   Sigel, Deborah A ^c   Walkemeyer, Phillip E ^c   Trease, Brian P ^c  

^a Brigham Young University   (United States)

^b Robert J Lang Origami   (United States)

^c CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; SPACE APPLICATIONS;

CIRCULAR ARRAYS; DEPLOYABLE SYSTEMS; FOLDED STATE; MATERIAL THICKNESS; OUTER DIAMETERS; RIGID PANELS; SOLAR ARRAYS;

DESIGN;

EID: 84897012802     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/DETC2013-12348     Document Type: Conference Paper

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