Encapsulation of aliphatic amines using microfluidics

Langmuir

Volumn 30, Issue 9, 2014, Pages 2346-2350

  Chen, Philipp W ^a   Cadisch, Gian ^a   Studart, André R ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ALIPHATIC AMINES; CROSS-LINKERS; DOUBLE EMULSIONS; INTERFACIAL POLYMERIZATION; MICRO-FLUIDIC DEVICES; MICROCAPSULES; NON-VOLATILE; REACTIVE MIXTURES;

AMINES; EMULSIFICATION; EPOXY RESINS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; POLYMERIZATION;

ENCAPSULATION;

EID: 84896759136     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la500037d     Document Type: Article

References (20)

1. White, S.; Sottos, N.; Geubelle, P.; Moore, J.; Kessler, M.; Sriram, S.; Brown, E.; Viswanathan, S. Autonomic healing of polymer composites Nature 2001, 409, 794-797
2. Caruso, M. M.; Blaiszik, B. J.; Jin, H.; Schelkopf, S. R.; Stradley, D. S.; Sottos, N. R.; White, S. R.; Moore, J. S. Robust, double-walled microcapsules for self-healing polymeric materials Appl. Mater. Interfaces 2010, 2, 1195-1199
3. Brown, E.; Kessler, M.; Sottos, N.; White, S. In situ poly(urea-formaldehyde) microencapsulation of dicyclopentadiene J. Microencapsulation 2003, 20, 719-730
4. Yuan, L.; Liang, G.; Xie, J.; Li, L.; Guo, J. Preparation and characterization of poly(urea-formaldehyde) microcapsules filled with epoxy resins Polymer 2006, 47, 5338-5349
5. Cosco, S.; Ambrogi, V.; Musto, P.; Carfagna, C. Urea-formaldehyde microcapsules containing an epoxy resin: influence of reaction parameters on the encapsulation yield Macromol. Symp. 2006, 234, 184-192
6. Blaiszik, B. J.; Caruso, M. M.; McIlroy, D. A.; Moore, J. S.; White, S. R.; Sottos, N. R. Microcapsules filled with reactive solutions for self-healing materials Polymer 2009, 50, 990-997
7. McIlroy, D. A.; Blaiszik, B. J.; Caruso, M. M.; White, S. R.; Moore, J. S.; Sottos, N. R. Microencapsulation of a reactive liquid-phase amine for self-healing epoxy composites Macromolecules 2010, 43, 1855-1859
8. Jin, H.; Mangun, C. L.; Stradley, D. S.; Moore, J. S.; Sottos, N. R.; White, S. R. Self-healing thermoset using encapsulated epoxy-amine healing chemistry Polymer 2012, 53, 581-587
9. Li, Q.; Mishra, A. K.; Kim, N. H.; Kuila, T.; Lau, K.-t.; Lee, J. H. Effects of processing conditions of poly(methylmethacrylate) encapsulated liquid curing agent on the properties of self-healing composites Composites, Part B 2013, 49 6-15
10. Utada, A.; Lorenceau, E.; Link, D.; Kaplan, P.; Stone, H.; Weitz, D. Monodisperse double emulsions generated from a microcapillary device Science 2005, 308, 537-541
11. Oh, H.-J.; Kim, S.-H.; Baek, J.-Y.; Seong, G.-H.; Lee, S.-H. Hydrodynamic micro-encapsulation of aqueous fluids and cells via 'on the fly' photopolymerization J. Micromech. Microeng. 2006, 16, 285-291
12. Chen, P. W.; Erb, R. M.; Studart, A. R. Designer polymer-based microcapsules made using microfluidics Langmuir 2012, 28, 144-152
13. Keller, M. W.; Sottos, N. R. Mechanical properties of microcapsules used in a self-healing polymer Exp. Mech. 2006, 46, 725-733
14. Choi, S.; Janisse, A. P.; Liu, C.; Douglas, E. P. Effect of water addition on the cure kinetics of an epoxy-amine thermoset J. Polym. Sci., Part A: Polym. Chem. 2011, 49, 4650-4659
15. Neuser, S.; Chen, P. W.; Studart, A. R.; Michaud, V. Fracture toughness healing in epoxy containing both epoxy and amine loaded capsules. Adv. Eng. Mater. 2013, doi: 10.1002/adem.201300422.
16. Erb, R. M.; Obrist, D.; Chen, P. W.; Studer, J.; Studart, A. R. Predicting sizes of droplets made by microfluidic flow-induced dripping Soft Matter 2011, 7, 8757-8761
17. Rotem, A.; Abate, A. R.; Utada, A. S.; Van Steijn, V.; Weitz, D. A. Drop formation in non-planar microfluidic devices Lab Chip 2012, 12, 4263-4268
18. Romanowsky, M. B.; Abate, A. R.; Rotem, A.; Holtze, C.; Weitz, D. A. High throughput production of single core double emulsions in a parallelized microfluidic device Lab Chip 2012, 12, 802-807
19. van der Graaf, S.; Schroën, C. G. P. H.; Boom, R. M. Preparation of double emulsions by membrane emulsification-a review J. Membr. Sci. 2005, 251, 7-15
20. Chen, J.; Nakamura, T.; Aoki, K.; Aoki, Y.; Utsunomiya, T. Curing of epoxy resin contaminated with water J. Appl. Polym. Sci. 2001, 79, 214-220