Integrated metallization system for high density interconnects and modified semi additive processing

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Volumn , Issue , 2013, Pages 241-244

  Feng, Kesheng ^a   Spencer, Tim ^a   Watkowski, Jim ^a  

^a MacDermid Incorporated   (United States)

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Indexed keywords

EID: 84893965330     PISSN: 21505934     EISSN: 21505942     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2013.6706700     Document Type: Conference Paper

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