Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding

2013 3rd International Electric Drives Production Conference, EDPC 2013 - Proceedings

Volumn , Issue , 2013, Pages

  Syed Khaja, Aarief Hussain ^a   Kaestle, C ^a   Franke, J ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

copper wire bonding; diffusion soldering; power electronic packaging; process quality; tool wear out

Indexed keywords

COPPER; DEPOSITION; DIFFUSION; ELECTRIC DRIVES; ELECTRONICS PACKAGING; OPTIMIZATION; POWER ELECTRONICS; PROCESS CONTROL; PROCESS MONITORING; WEAR OF MATERIALS; WIRE;

COPPER WIRE BONDINGS; DIFFUSION SOLDERING; POWER ELECTRONIC PACKAGING; PROCESS QUALITY; TOOL WEAR;

SOLDERING;

EID: 84893500246     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDPC.2013.6689763     Document Type: Conference Paper

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