Large-area laser-lift-off processing in microelectronics

Physics Procedia

Volumn 41, Issue , 2013, Pages 241-248

  Delmdahl, R ^a   Patzel R ^a   Brune, J ^a  

^a Coherent GmbH ^*  (Germany)

Author keywords

Excimer laser; Flat panel display; HB LED; Laser lift off; Thin wafer debonding

Indexed keywords

EID: 84893128212     PISSN: 18753884     EISSN: 18753892     Source Type: Conference Proceeding    
DOI: 10.1016/j.phpro.2013.03.075     Document Type: Conference Paper

References (3)

1. Delmdahl, R., 2010. The Excimer laser: Precision Engineering, Nature Photonics 4, p. 286.
2. Zussman, M., Milasincic, C., Rardin, A., Kirk, S., Itabashi, T., 2010. Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling, J Microelectronics and Electronic Packaging 7, p. 214.
3. Delmdahl, R., Pätzel, R., Brune, J., Senczuk, R., Goßler, C., Moser, R., Kunzer, M., Schwarz, U., 2012. Line Beam Processing for Laser Lift-Off of GaN from Sapphire, Phys Status Solidi A 209, p. 2653.