Investigation on forming process of copper alloys via Selective Laser Melting

High Value Manufacturing: Advanced Research in Virtual and Rapid Prototyping - Proceedings of the 6th International Conference on Advanced Research and Rapid Prototyping, VR@P 2013

Volumn , Issue , 2014, Pages 285-289

  Zhang, D Q ^a   Liu, Z H ^a   Chua, C K ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BASE PLATES; DENSIFICATION BEHAVIOUR; FORMING PARAMETERS; LAYER THICKNESS; RELATIVE DENSITY; SELECTIVE LASER MELTING; THERMAL AND ELECTRICAL CONDUCTIVITY; WALL THICKNESS;

COPPER ALLOYS; MICROSTRUCTURE; RAPID PROTOTYPING;

INDUSTRIAL RESEARCH;

EID: 84892183336     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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