Electrodeposition process for the fabrication of copper dendrites film with stable superhydrophobicity

Acta Metallurgica Sinica (English Letters)

Volumn 26, Issue 6, 2013, Pages 641-646

  Shen, Huan ^a   Wang, Fengping ^a   Ding, Yanwei ^a   Yang, Jun ^b  

^a LIAONING NORMAL UNIVERSITY   (China)

^b DALIAN JIAOTONG UNIVERSITY   (China)

Author keywords

Copper; Electrodeposition; Ethanol; Superhydrophobic surface

Indexed keywords

ANTICORROSION PERFORMANCE; ELECTRODEPOSITION PROCESS; FACE-CENTERED CUBIC; POLARIZATION CURVES; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBICITY; WEIGHT LOSS MEASUREMENTS; XRD (X RAY DIFFRACTION);

CONTACT ANGLE; COPPER; CORROSION RESISTANCE; DENDRITES (METALLOGRAPHY); ELECTRODEPOSITION; ETHANOL; PALMITIC ACID; SATURATED FATTY ACIDS; SOLUTIONS; SURFACE PROPERTIES; X RAY DIFFRACTION;

HYDROPHOBICITY;

EID: 84891750026     PISSN: 10067191     EISSN: None     Source Type: Journal    
DOI: 10.1007/s40195-013-0226-5     Document Type: Article

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