Wafer-to-wafer transfer process of barium strontium titanate metal-insulator-metal structures by laser pre-irradiation and gold-gold bonding for frequency tuning applications

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 171-174

  Samoto, T ^a   Hirano, H ^a   Somekawa, T ^b   Hikichi, K ^a   Fujita, M ^b   Esashi, M ^a   Tanaka, S ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b INSTITUTE FOR LASER TECHNOLOGY   (Japan)

Author keywords

Barium strontium titanate; Laser assisted transfer process; Metal insulator metal variable capacitor; Wafer to wafer bonding

Indexed keywords

GOLD-GOLD BONDINGS; HIGH TEMPERATURE; METAL-INSULATOR-METAL STRUCTURES; SAPPHIRE SUBSTRATES; TRANSFER PROCESS; TRANSPARENT SUBSTRATE; VARIABLE CAPACITOR; WAFER TO WAFER BONDING;

ACTUATORS; BARIUM STRONTIUM TITANATE; GOLD; IRRADIATION; METAL INSULATOR BOUNDARIES; MICROSYSTEMS; MIM DEVICES; SAPPHIRE; SOLID-STATE SENSORS; SUBSTRATES; VARIABLE FREQUENCY OSCILLATORS;

WAFER BONDING;

EID: 84891717241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6626729     Document Type: Conference Paper

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