Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Volumn , Issue , 2012, Pages

  Li, Er Ping ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84891584983     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781118166727     Document Type: Book

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