Practical Reliability Engineering: Fifth Edition

Practical Reliability Engineering: Fifth Edition

Volumn , Issue , 2011, Pages

  O'Connor, Patrick D T ^a   Kleyner, Andre ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84891583437     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781119961260     Document Type: Book

References (305)

1. British Standard, BS 4778 (1991) Glossary of Terms Used in Quality Assurance (including reliability and maintainability). British Standards Institution, London.
2. British Standard, BS 5760 (1996) Reliability of Systems, Equipments and Components. British Standards Institution, London.
3. Deming,W. (1986) Out of the Crisis,MIT University Press (originally published under the title Quality, Productivity and Competitive Position).
4. Drucker, P. (1995) The Practice of Management. Heinemann.
5. Kleyner, A. (2010) Determining Optimal Reliability Targets, Lambert Academic Publishing.
6. Misra, K. (ed.) (2008) The Handbook of Performability Engineering, Springer-Verlag, London.
7. UK Defence Standard 00-40. The Management of Reliability and Maintainability. HMSO.
8. US MIL-STD-721. Definitions of Effectiveness Terms for Reliability, Maintainability,Human Factors and Safety.National Technical Information Service, Springfield, Virginia.
9. US MIL-STD-785. Reliability Programs for Systems and Equipment.National Technical Information Service, Springfield, Virginia (suspended in 1976).
10. International Journal of Performability Engineering. Available at: http://www.ijpe-online.com/Microelectronics Reliability, Elsevier (published monthly).
11. Proceedings of the US Reliability and Maintainability Symposium (RAMS). American Society for Quality and IEEE (published annually).
12. Quality and Reliability Engineering International, Wiley (published quarterly).
13. Reliability Engineering and Systems Safety, Elsevier (published monthly).
14. Transactions on Reliability, Institute of Electrical and Electronics Engineers (IEEE) (published quarterly).
15. Chatfield, C. (1983) Statistics for Technology, 2nd edn, Chapman & Hall.
16. Conover, W. (1998) Practical Non-parametric Statistics, J. Wiley.
17. Hines, W. and Montgomery, D. (1990) Probability and Statistics in Engineering and Management Science, 3rd edn, Wiley.
18. Langley, R. (1979) Practical Statistics Simply Explained, 2nd edn, Pan.
19. Modarres, M. Kaminskiy, M. Krivtsov V. (1999) Reliability Engineering and Risk Analysis, 2nd edn, Marcel Dekker.
20. Montgomery, D., Runger, G., Hubele, M. (2006) Engineering Statistics, 4th edn, J. Wiley.
21. NIST (2011) Section 1.3.6.7.3 Upper Critical Values of the F Distribution. Engineering Statistics Handbook, published by NIST. Available at: http://www.itl.nist.gov/div898/handbook/eda/section3/eda3673.htm.
22. Ryan, T. (2000) Statistical Methods for Quality Improvement, Wiley.
23. Abernethy, R. (2003) The New Weibull Handbook, 5th edn, Dr. Robert Abernethy.
24. Duncan, A. (1986) Quality Control and Industrial Statistics, 5th edn, Irwin.
25. Hahn G., Meeker, W. (1991) Statistical Intervals, a Guide for Practitioners, J. Wiley.
26. Hollander, M., Wolfe, D. (1999) Non-parametric Statistical Methods, 2nd edn, J. Wiley.
27. Kleyner, A., Bhagath, S., Gasparini, M. et al. (1997) Bayesian techniques to reduce the sample size in automotive electronics attribute testing. Microelectronics and Reliability, 37(6), 879-883.
28. Martz, H. and Waller, A. (1982) Bayesian Reliability Analysis, J. Wiley.
29. Modarres, M., Kaminskiy, M. and Krivtsov, V. (1999) Reliability Engineering and Risk MINITAB (2011) (General purpose statistics training and application software). Minitab Inc. 3081 Enterprise Drive, PA 16801, USA. (The MINITAB Handbook (Duxbury Press, Boston) is an excellent introduction to basic statistics), www.mintab.com.
30. National Institute of Standards and Technology (NIST). NIST/SEMATECH e-Handbook of Statistical Methods http://www.itl.nist.gov/div898/handbook/October 2010.
31. Nelson, W. (2003) Applied Life Data Analysis, J. Wiley.
32. SAS Business Analytics Software Manual. http://www.sas.com/resources/.
33. Seitano, S. (2001) Engineering Uncertainty and Risk Analysis, Hydroscience Inc.
34. Wassreman, G. (2003) Reliability Verification Testing, and Analysis in Engineering Design, Marcel Dekker.
35. Abernethy, R. (2003) The New Weibull Handbook, 5th edn, Dr. Robert Abernethy.
36. Hines, W. and Montgomery, D. (1990) Probability and Statistics in Engineering and Management Science, 3rd edn, Wiley.
37. Kleyner A. and Sandborn P. (2005) A warranty forecasting model based on piecewise statistical distributions and stochastic simulation. Reliability Engineering and System Safety, 88(3), 207-214.
38. Lawless, J. (2002) Statistical Models and Methods for Lifetime Data, Wiley.
39. Meeker, W. and Escobar, L. (1998) Statistical Methods for Reliability Data, Wiley.
40. Nelson, W. (1982) Applied Life Data Analysis, Wiley.
41. ReliaSoft (2006) Life Data Analysis Reference: Confidence Bounds.Online tutorial.Available at: http://www.weibull.com/LifeDataWeb/confidence_bounds.htm.
42. ReliaSoft (2008a) Life Data Analysis Reference, ReliaSoft Publishing.
43. ReliaSoft (2008b) Weibull++R User's Guide, ReliaSoft Publishing.
44. ReliaSoft (2011) Probability Plotting Papers. Available at http://www.weibull.com/GPaper/index.htm.
45. Wasserman, G. (2003) Reliability Verification Testing, and Analysis in Engineering Design, Marcel Dekker.
46. Weibull, W. (1951) A statistical distribution function of wide applicability. Journal of Applied Mechanics, 18, 293-297.
47. Faulin, J., Juan, A., Martorell, S. and Ramírez-Márquez, J.-E. (eds) (2010) Simulation Methods for Reliability and Availability of Complex Systems, Springer-Verlag.
48. Hazelrigg, G. (1996) Systems Engineering: An Approach to Information-Based Design, Prentice Hall.
49. Palisade (2005) Guide to Using @Risk. Advanced Risk Analysis for Spreadsheets, Palisade Corporation, Newfield, New York. Available at: http://www.palisade.com (Accessed February 2011).
50. Roberts, C. and Casella, G. (2004) Monte Carlo Statistical Methods, 2nd edn, Springer.
51. Rubinstein R. and Kroese D. (2008) Simulation and the Monte Carlo Method, 2nd edn (Wiley Series in Probability and Statistics), Wiley.
52. Sandborn, P. (2011) Electronic Systems Cost Modeling - Economics of Manufacturing and Life Cycle. Chapter 10 (Uncertainty Modeling). World Scientific Publishing, Co.
53. Wikipedia (2010) Inverse Transform Sampling: Available at: http://en.wikipedia.org/wiki/Inverse_transform_sampling.
54. Carter, A. (1997) Mechanical Reliability and Design, Wiley.
55. Kapur K. and Lamberson L. (1977) Reliability in Engineering Design, Wiley.
56. Palisade Corporation (2005) Guide to Using @Risk. Advanced Risk Analysis for Spreadsheets' Palisade Corporation. Newfield, New York. Available at http://www.palisade.com.
57. ReliaSoft (2002) Prediction Warranty Returns Based on Customer Usage Data. Reliability Edge, Quarter 1: Volume 3, Issue 1. Available at http://www.reliasoft.com/newsletter/1q2002/usage.htm (Accessed 22 March 2011).
58. ReliaSoft (2008) Weibull++R User's Guide, ReliaSoft Publishing.
59. Wasserman, G. (2003) Reliability Verification, Testing and Analysis in Engineering Design, Marcel Dekker.
60. Alion System Reliability Center (2011) PRISM. Available at: http://src.alionscience.com/prism/ (Accessed 22 March 2011)
61. Andrews, J. and Moss, T. (2002) Reliability and Risk Assessment, ASME Press.
62. British Standard, BS 5760 (1991) Reliability of Systems, Equipments and Components, British Standards Institution, London.
63. British Telecom (1995) HRD5, Handbook of Reliability Data for Electronic Components used in Telecommunication Systems.
64. CALCE (2011) Center for Advanced Life Cycle Engineering. Available at http://www.calce.umd.edu/ (Accessed 22 March 2011).
65. Dylis, D (2001) PRISM: A new approach to reliability prediction. Amer. Soc. Quality (ASQ) Reliability Review, 21(1), March issue.
66. Dylis, D. and Priore, M. (2001) A Comprehensive Reliability Assessment Tool for Electronic Systems, IIT Research/ Reliability Analysis Center, Rome NY, Available at: http://www.theriac.org/productsandservices/products/217plus/rams01.pdf
67. FIDES (2009) FIDES Guide 2009 Issue A. Available at http://fides-reliability.org/ (Accessed 22 March 2011)
68. Foucher, B., Boullié, J.B., Meslet, B. and Das, D. (2002) A review of reliability prediction methods for electronic devices. Microelectronics Reliability, 42(8), 1155-1162.
69. Høyland, A., Rausand, M. (2004) System Reliability Theory, Models and Statistical Methods, 2nd edn, Wiley.
70. IEEE Standard 1413.1-2002 (2003) IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413, IEEE.
71. Kaminskiy, M. and Krivtsov, V. (2000) G-Renewal Process as a Model for Statistical Warranty Claim Prediction. Proceedings of the Annual Reliability and Maintainability Symposium (RAMS).
72. Kleyner, A. and Volovoi, V. (2008) Reliability Prediction using Petri Nets for On-Demand Safety Systems with Fault Detection, in Safety and Reliability and Risk Analysis (eds Martorell, Soares and Barnett), (European Safety and Reliability conference), v.3, pp. 1961-1968.
73. Kleyner, A. and Bender, M. (2003) Reliability Prediction Method Based on Merging Military Standards Approach with Manufacturer's Warranty Data. Proceedings of Annual Reliability and Maintainability Symposium (RAMS), Tampa, Florida, pp. 202-206.
74. Kleyner, A. and Boyle, J. (2003) Reliability Prediction of Substitute Parts Based on Component Temperature Rating and Limited Accelerated Test Data. Proceedings of Annual Reliability and Maintainability Symposium, Tampa, Florida, pp. 518-522.
75. McLeish, J. (2010) Enhancing MIL-HDBK-217 Reliability Predictions with Physics of Failure Methods. Proceedings of the Annual Reliability and Maintainability Symposium (RAMS).
76. MIL-HDBK-217F (1995) Military Handbook, Reliability Prediction of Electronic Equipment, Notice 2, Department of Defense, Washington, DC.
77. Nicholls, D. (2007) What is 217PlusTM and Where Did it Come From? Proceedings of the Annual Reliability and Maintainability Symposium (RAMS).
78. Nippon Telegraph and Telephone Corporation (1985) Standard Reliability Table for Semiconductor Devices.
79. NSWC-06/LE10 (2006) Handbook of Reliability Prediction Procedures for Mechanical Equipment, Edition 2006. US Naval Surface Warfare Center, Carderock Division, West Bethesda, Maryland 20 817-5700. Available at: http://www.everyspec.com/USN/NSWC/NSWC-06_RELIAB_HDBK_2006_15051/.
80. Pukite J. and Pukite P. (1998) Markov Modelling for Reliability Analysis, IEEE Press.
81. RAIC (2010) Electronic Reliability Prediction.Available at http://www.theriac.org/DeskReference/viewDocument.php?id=11 (Accessed 22 March 2011).
82. RAIC (2011) 217Plus: RAIC's Reliability Prediction Methodology. Available at http://www.theriac.org/productsandservices/products/217plus/ (Accessed 22 March 2011).
83. ReliaSoft (2006) Standards Based Reliability Prediction in a Nutshell. Reliability Hotwire Issue 70, http://www.weibull.com/hotwire/issue70/relbasics70.htm (Accessed 22 March 2011).
84. Singh, C. and Billinton, R. (1977) System Reliability Modeling and Evaluation, Hutchinson.
85. Talmor, M. and Arueti, S. (1997) Reliability Prediction: The Turn-Over Point. Proceedings of Reliability and Maintainability Symposium (RAMS).
86. Telcordia Special Report SR-332 (2001) Reliability Prediction Procedure for Electronic Equipment (RPP). Issue 1, Telcordia Customer Service, Piscataway, NJ.
87. UTEC80810 (2000) Modele universel pour le calcul de la fiabileite previsionnelle des composants, cartes et equipememts electroniques - RDF2000.
88. Yakovlev, A., Gomes, L. and Lavagno, L. (2007) Hardware Design and Petri Nets, Kluwer Academic Publishers.
89. Yang, S. and Liu, T. (1997) Failure Analysis for an Airbag Inflator by Petri Nets. Quality and Reliability Engineering International, 13, 139-151.
90. Yang, S. and Liu, T. (1998) A Petri Net Approach to Early Failure Detection and Isolation for Preventive Maintenance. Quality and Reliability Engineering International, 14, 319-330.
91. AIAG (2003) Potential Failure Mode & Effects Analysis: FMEA-3. Available at www.aiag.org.
92. Akao, Y. (1990) QFD: Quality Function Deployment - Integrating Customer Requirements into Product Design, Productivity Press.
93. Allan, L. (2008) Change Point Analysis and DRBFM: AWinning Combination. Reliability Edge (published by ReliaSoft), volume 9, issue 2. Available at http://www.reliasoft.com/newsletter/v9i2/drbfm.htm.
94. British Standard, BS 5760. Reliability of Systems, Equipment and Components. British Standards Institution, London.
95. Brombacher, A. (1999) Maturity Index on Reliability: Covering Non-technical Aspects of IEC61508. Reliability Certification Reliability Engineering & System Safety, 66(2), 109-120.
96. Clausing, D. (1994) Total Quality Development: a Step by Step Guide to World Class Concurrent Engineering, ASME Press.
97. Creveling C., Slutsky, J. and Antis, D. (2003) Design for Six Sigma in Technology and Product Development, Prentice Hall.
98. Crowe, D. and Feinberg, A. (2001) Design for Reliability (Electronics Handbook Series), CRC Press, Boca Raton.
99. Mettas, A. (2010) Design for Reliability: Overview of the Process and Applicable Techniques. International Journal of Performability Engineering (IJPE), 6(6), November 2010 - Paper 4 - 577-586.
100. ReliaSoft (2001) Using Degradation Data for Life Data Analyses, Reliability Edge, Volume 2, Issue 2. Available at: http://www.reliasoft.com/newsletter/2q2001/degradation.htm.
101. ReliaSoft (2003) Process FMEA sample (Front Door L.H), Available at http://www.weibull.com/basics/fmea_fig1.htm.
102. ReliaSoft (2007) Fundamentals of Design for Reliability: RS 560 Course Notes. Available at http://www.reliasoft.com/seminars/gencourses/rs560.htm.
103. ReliaSoft (2008) Design for Reliability: Overview of the Process and Applicable Techniques. Reliability Edge, Volume 8, Issue 2. http://www.reliasoft.com/newsletter/v8i2/reliability.htm.
104. Ryan, T. (2000) Statistical Methods for Quality Improvement, Wiley.
105. SAE J-1739, Potential Failure Mode and Effects Analysis. Society of Automotive Engineers, USA.
106. Silverman, M. (2010) How Reliable is Your Product? 50 Ways to Improve Product Reliability, Super Star Press, Silicon Valley, California.
107. Stamatis, D. (2003) Failure Mode and Effect Analysis: FMEA from Theory to Execution, 2nd edn, American Society for Quality (ASQ) Press.
108. US MIL STD1629A: Failure Mode and Effects Analysis. National Technical Information Service, Springfield, Virginia.
109. Wickens, C., Lee, J., Liu Y. and Gordon-Becker, S. (2003) Introduction to Human Factors Engineering, 2nd edn, Prentice Hall.
110. Anderson, T.L. (2005) Fracture Mechanics, CRC Press.
111. Collins, J.A. (1981) Failure of Materials in Mechanical Design, J. Wiley.
112. Dowling, N.E. (2006) Mechanical Behaviour of Materials, 2nd edn, Pearson Education.
113. Gordon, J.E. (1991) The New Science of Strong Materials, Penguin Books. Wear
114. Neale, M.J. (1995) The Tribology Handbook, 2nd edn, Butterworth-Heinemann.
115. Summers-Smith, J.D. (1994) An Introductory Guide to Industrial Tribology, Mechanical Engineering Publications. Corrosion
116. Revie, R.W. (2011) Uhlig's Corrosion Handbook, 3rd edn, J. Wiley.
117. Piersol, A.G. and Paez, T.L. (2009) Harris' Shock and Vibration Handbook, 6th edn, McGraw-Hill.
118. Steinberg, D. (2000) Vibration Analysis for Electronic Equipment, 3rd edn, Wiley. Materials and components
119. Brostow, W. and Corneliussen, R. (1986) Failure of Plastics, Hanser.
120. Crane, F.A., Charles, J.A. and Furness, J.A. (1997) Selection and Use of Engineering Materials, 3rd edn, Butterworth- Heinemann.
121. Summers-Smith, J. (1992) Mechanical Seal Practice for Improved Performance, 2nd edn, Mechanical Engineering Publications.
122. CALCE (2011) Lead Free and Green Electronics Forum, CALCE, University of Maryland. Available at: http://www.calce.umd.edu/lead-free/index.html.
123. Clech, J-P. (2004) Lead-Free and Mixed Assembly Solder Joint Reliability Trends. Proceedings (CD-ROM), IPC / SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 23-26, 2004, pp. S28-3-1 through S28-3-14. Available at http://www.jpclech.com/EPSI_Publications.html.
124. Clech, J-P., Henshall, G. and Miremadi, J. (2009) Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies, Proceedings of SMTA International Conference (SMTAI 2009), Oct. 4-8, 2009, San Diego, CA.
125. DfR Solutions (2010) Pb-Free Solder Joints. Available at http://www.dfrsolutions.com/pb-free-solder-joints/.
126. Evans, J. (2010) A Guide to Lead-free Solders. Physical Metallurgy and Reliability (ed. W. Engelmaier), Springer.
127. Garrou, P. and Gedney, R. (2004) Tin Whiskers: An Industry Perspective. Advanced Packaging, December 2004 issue.
128. Horowitz P. and Hill, W. (1989) The Art of Electronics, 2nd edn, Cambridge University Press.
129. JEDEC (2006) JESD201 standard, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes. Available at http://www.jedec.org/standards-documents.
130. Pascoe, N. (2011) Reliability Technology: Principles and Practice of Failure Prevention in Electronic Systems, Wiley.
131. Pecht, M. (ed.) (1995) Product Reliability, Maintainability and Supportability Handbook. ARINC Research Corp. US MIL-HDBK-338. Electronic Reliability Design Handbook. Available from the National Technical Information Service, Springfield, Virginia.
132. Amerasekera, E. and Najm, F. (1997) Failure Mechanisms in Semiconductor Devices, 2nd edn, Wiley.
133. Bajenescu, T. and Bazu, M. (2011) Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems, J. Wiley.
134. Brindley, K. and Judd, M. (1999) Soldering in Electronics Assembly, Newnes.
135. Bajenescu, T. and Bazu, M. (1999) Reliability of Electronic Components, Springer-Verlag. British Standard, BS 9000. Components of Assessed Quality. British Standards Institution, London. (And equivalent US MIL, European (CECC) and International (IEC) standards.)
136. Das, D., Pendse, N., Wilkinson, C. and Pecht, M. (2001) Parameter Recharacterization: A Method of Thermal Uprating. IEEE Transactions on Components and Packaging Technologies, 24(4), December 2001
137. Hannemann, R., Kraus, A. and Pecht, M. (1997) Semiconductor Packaging: A Multidisciplinary Approach, Wiley.
138. Harper, C. (2004) Electronic Packaging and Interconnection Handbook, 4th edn, McGraw-Hill Professional.
139. IEC TR 62240. (2005) Process management for avionics -Use of semiconductor devices outside manufacturers' specified temperature range
140. Jensen, F. (1995) Electronic Component Reliability, Wiley.
141. Kleyner, A. and Boyle, J. (2003) Reliability Prediction of Substitute Parts Based on Component Temperature Rating and Limited Accelerated Test Data. Proceedings of Annual Reliability and Maintainability Symposium, Tampa, Florida, pp. 518-522.
142. Kuo, W., Chien, W. and Kim, T. (1998) Reliability, Yield, and Stress Burn-In: a Unified Approach for Microelectronics Systems Manufacturing & Software Development, Springer.
143. Lau, J.,Wong, C., Prince J. and Nakayama,W. (1998) Electronic Packaging: Design, Materials, Process, and Reliability, McGraw-Hill.
144. Ohring, M. (1998) Reliability and Failure of Electronic Materials and Devices, Academic Press.
145. Pecht, M. (ed.) (1993) Soldering Processes and Equipment, Wiley.
146. Pecht, J. and Pecht, M. (eds) (1995) Long-Term Non-Operating Reliability of Electronic Products, CRC Press.
147. Pecht, M., Radojcic, R. and Rao, G. (1999) Guidebook for Managing Silicon Chip Reliability, CRC Press.
148. Tummala, R. (2001) Fundamentals of Microsystems Packaging, McGraw-Hill.
149. Tummala, R., Rymaszewski, E. and Klopfenstein, A. (1997) Microelectronics Packaging Handbook, Kluwer Academic Publishers.
150. US MIL-STD-883. Test Methods and Procedures for Microelectronic Devices. Available from the National Technical Information Service, Springfield, Virginia.
151. Woodgate, R. (1996) The Handbook of Machine Soldering: SMT and TH, 3rd edn, Wiley-Interscience. Mechanical and thermal effects and design
152. Lall, P., Pecht, M. and Hakim, E. (1997) Influence of Temperature on Microelectronics and System Reliability, CRC Press.
153. McCluskey, P., Grzybowski R. and Podlesak, T. (eds) (1997) High Temperature Electronics, CRC Press.
154. Sergent, J. and Krum, A. (1998) Thermal Management Handbook: For Electronic Assemblies, McGraw-Hill.
155. Steinberg, D. (2000) Vibration Analysis for Electronic Equipment, 3rd edn, Wiley. Thermal Guide for Reliability Engineers. Rome Air Development Center Report TR-82-172. Available from the National Technical Information Service, Springfield, Virginia.
156. Chatterton, P. and Houlden, M. (1991) EMC: Electromagnetic Theory to Practical Design, Wiley.
157. Ott, H. (2009) Electromagnetic Compatibility Engineering, Wiley-Interscience.
158. Schmitt, R. (2002), Electromagnetics Explained: A Handbook for Wireless/RF, EMC, and High-Speed Electronics. Elsevier.
159. US MIL-E-6051D, Electromagnetic Compatibility Requirements, Systems. NTIS, Springfield, VI.
160. US MIL-STD-461D, Requirements for the Control of Electromagnetic Interference Emisions and Susceptibility. NTIS, Springfield VI.
161. O'Connor, P.D.T. (2001) Test Engineering. Wiley.
162. Singhal, K. and Vlach, J. (2010) Computer Methods for Circuit Analysis and Design, Kluwer Academic Publishers.
163. Spence, R. and Soin, R. (1988) Tolerance Design in Electronic Circuits, Addison-Wesley.
164. Turino, J. and Binnendyk, H. (1991) Design to Test, 2nd edn, Logical Solutions Inc., Campbell, CA (Also Testability Advisor software).
165. Beizer, B. (1995) Black-Box Testing, J. Wiley and Sons.
166. Kaner, C., Falk, J. and Nguyen, H. (1999) Testing Computer Software, 2nd edn, Wiley.
167. Leveson, N. (1995) Safeware - System Safety & Computers, Addison Wesley.
168. Musa, J. (2004) Software Reliability Engineering: more reliable software faster and cheaper (2nd edn.) Authorhouse.
169. Musa, J., Iannino, A. and Okumoto, K. (1987) Software Reliability Prediction and Measurement, McGraw-Hill.
170. Ould, M.A. and Unwin, C. (1986) Testing in Software Development, Cambridge University Press.
171. Patton, R (2006) Software Testing, 2nd edn, SAMS Publishing.
172. US DoD Standard 2168 Defence System Software Quality Program. Available from the National Technical Information Service, Springfield, Virginia.
173. ISO/IEC 90003. (2004) Guidelines for the Application of ISO 9001 to Computer Software
174. Bhote, K.R. (1988) World Class Quality, American Management Association.
175. Box, G.E., Hunter, W.G. and Hunter, J.S. (1978) Statistics for Experimenters, Wiley.
176. Breyfogle, F. (1992) Statistical Methods for Testing, Development and Manufacturing, Wiley-Interscience.
177. Condra, L. (1993) Reliability Improvement with Design of Experiments, Marcel Dekker.
178. Deshpande, J., Gore, A. and Shanubhogue, A. (1995) Statistical Analysis of Nonnormal Data, Wiley.
179. Grove, D. and Davis, T. (1992) Engineering Quality and Design of Experiments, Longman Higher Education.
180. Hinkelmann, K. and Kempthorne, O. (2008) Design and Analysis of Experiments, Introduction to Experimental Design, Wiley Series in Probability and Statistics.
181. Lipson, C. and Sheth, N.J. (1973) Statistical Design and Analysis of Engineering Experiments, McGraw-Hill.
182. Logothetis, N. and Wynn, H. (1990) Quality through Design, Oxford University Press.
183. Mason, R.L., Gunst R.F. and Hess J.L. (1989) Statistical Design and Analysis of Experiments, Wiley.
184. Mathews, P. (2005) Design of Experiments with MINITAB, American Society for Quality (ASQ) Press.
185. Montgomery, D. (2000) Design and Analysis of Experiments, 5th edn, Wiley.
186. NIST (2011) Section 1.3.6.7.3 Upper Critical Values of the F-Distribution. Engineering Statistics Handbook, published by NIST. Available at: http://www.itl.nist.gov/div898/handbook/eda/section3/eda3673.htm.
187. Park, S. (1996) Robust Design and Analysis for Quality Engineering, Chapman & Hall.
188. Ross, P.J. (1988) Taguchi Techniques for Quality Engineering, McGraw-Hill.
189. Roy, R. (2001) Design of Experiments Using the Taguchi Approach, Wiley-Interscience.
190. Ryan, T. (2001) Statistical Methods for Quality Improvement, 2nd edn, Wiley-Interscience.
191. Taguchi, G. (1986) Introduction to Quality Engineering, Unipub/Asian Productivity Association.
192. Taguchi, G. (1978). Systems of Experimental Design, Unipub/Asian Productivity Association. Environmental Stress Screening Guidelines. Institute of Environmental Sciences and Technology (USA).
193. GMW 3172 (2004) General Specification for Electrical/Electronic Component Analytical/Development/Validation (A/D/V) Procedures for Conformance to Vehicle Environmental, Reliability, and Performance Requirements, General Motors Worldwide Engineering standard. Available at www.global.ihs.com (Accessed 20 March 2011).
194. Harris, C., Piersol, A. and Paez, T. (eds) (2010) Shock and Vibration Handbook, 6th edn, McGraw-Hill. IEC 61 000. Electromagnetic Compatibility.
195. ISO/IEC 60068. Environmental Testing.
196. ISO/IEC 61163. Reliability Stress Screening.
197. McLean, H. (2009) HALT, HASS and HASA Explained: Accelerated Reliability Techniques, American Society for Quality.
198. O'Connor, P.D.T. (2001) Test Engineering, Wiley.
199. Steinberg, D. (2000) Vibration Analysis for Electronic Equipment, 3rd edn, Wiley.
200. UK Defence Standard 07-55. Environmental Testing. HMSO.
201. US MIL-HDBK-781. Reliability Testing for Engineering Development, Qualification and Production. Available from the National Technical Information Service, Springfield, Virginia.
202. US MIL-STD-462D. Measurement of Electromagnetic Interference Characteristics. Available from NTIS, Springfield, Virginia.
203. US MIL-STD-810. Environmental Test Methods. Available from the National Technical Information Service, Springfield, Virginia.
204. Ascher, H. and Feingold, H. (1984) Repairable Systems Reliability, Dekker.
205. Blischke, W. and Murthy, D. (1996) Product Warranty Handbook, Marcel Dekker.
206. Blischke, W., Karim, R. and Murthy, D. (2011) Warranty Data Collection and Analysis, Springer.
207. British Standard BS 5703. Guide to Data Analysis and Quality Control using Cusum Techniques. British Standards Institute, London.
208. British Standard, BS 5760. Reliability of Systems, Equipments and Components, Part 2. British Standards Institution, London.
209. Clech, J-P., Henshall, G. and Miremadi, J. (2009) Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies. Proceedings of SMTA International Conference (SMTAI 2009), Oct. 4-8, 2009, San Diego, CA.
210. ISO IEC 60605. Equipment Reliability Testing. International Standards Organisation, Geneva.
211. JEDEC (2009) JEP122F Failure Mechanisms and Models for Semiconductor Devices. Published by JEDEC Association. Available at http://www.jedec.org/Catalog/catalog.cfm.
212. Kalbfleisch, J., Lawless, J. and Robinson, J. (1991), Methods for the Analysis and Prediction of Warranty Claims. Technometrics, 33(3) August.
213. Kalbfleisch, J. and Prentice, R. (2002) The Statistical Analysis of Failure Time Data, 2nd edn, Wiley.
214. Kleyner, A. (2010a) In the Twilight Zone of Humidity Testing. TEST Engineering & Management, August/September issue.
215. Kleyner A. (2010b) Discussion Warranted. Quality Progress, International Monthly Journal of American Society for Quality (ASQ). May 2010 issue, pp. 22-27.
216. Kleyner, A. and Sandborn, P. (2008) Minimizing life cycle cost by managing product reliability via validation plan and warranty return cost. International Journal of Production Economics, 112, 796-807.
217. Lawson, R. (1984) A review of the status of plastic encapsulated semiconductor component reliability. British Telecommunication Technology Journal, 2(2), 95-111.
218. Moltoft, J. (1994) Reliability Engineering Based on Field Information: The Way Ahead. Quality and Reliability Engineering International, 10, 399-409.
219. Nelson, W. (1989) Accelerated Testing: Statistical Models, Test Plans and Data Analysis, Wiley.
220. NIST (2006) Eyring. National Institute of Standards and Technology, online Handbook section 8.1.5.2 Available at: http://www.itl.nist.gov/div898/handbook/apr/section1/apr152.htm.
221. Norris, K. and Landzberg, A. (1969) Reliability of Controlled Collapse Interconnections. IBM Journal of Research and Development, 13(3), 266-271.
222. Ohring, M. (1998) Reliability and Failure of Electronic Materials and Devices, Academic Press.
223. Pan, N., Henshall, G.A., Billaut, F. et al. (2005) An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability under Various Thermal Cycle Conditions, SMTA International, pp. 876-883.
224. Peck, D. (1986) Comprehensive Model for Humidity Testing Correlation. IEEE IRPS Proceedings, 44-50.
225. ReliaSoft (2010) Accelerated Life Testing Reference, ReliaSoft Publishing.
226. ReliaSoft (2010) ALTA-7 User's Guide, ReliaSoft Publishing.
227. ReliaSoft (2011) Accelerated Life Testing Reference. Online Reliability Engineering Resources. Available at http://www.weibull.com/acceltestwebcontents.htm.
228. Salmela, O. (2007) Acceleration Factors for Lead-Free Solder Materials. IEEE Transactions on Components and Packaging Technologies, 30(4), December 2007.
229. SEMATECH (2000) Semiconductor Device Reliability Failure Models. Technology Transfer # 00053955A-XFR. International SEMATECH Report. Available at: http://www.sematech.org/docubase/document/3955axfr.pdf.
230. Steinberg, D. (2000), Vibration Analysis for Electronic Equipment, 3rd edn, Wiley.
231. Steven E., Rigdon, S. and Basu, A. (2000) Statistical Methods for the Reliability of Repairable Systems, Wiley.
232. Trindade, D. and Nathan, S. (2005) Simple Plots for Monitoring the Field Reliability of Repairable Systems. Proceedings of the Annual Reliability and Maintainability Symposium (RAMS).
233. US MIL-HDBK-781. Reliability Testing for Equipment Development, Qualification and Production. Available from the National Technical Information Service, Springfield, Virginia.
234. British Standard, BS 5760. Reliability of Systems, Equipments and Components, Part 2. British Standards Institution, London.
235. Kleyner, A. and Boyle, J. (2004) The Myths of Reliability Demonstration Testing! TEST Engineering and Management, August/ September 2004, pp. 16-17.
236. Kleyner, A., Bhagath, S., Gasparini, M. et al. (1997) Bayesian Techniques to Reduce the Sample Size in Automotive Electronics Attribute Testing. Microelectronics and Reliability, 37(6), 879-883.
237. Lipson, C. and Sheth, N. (1973) Statistical Design and Analysis of Engineering Experiments, McGraw-Hill.
238. Møltoft, J. (1994) Reliability Engineering Based on Field Information: The Way Ahead. Quality and Reliability Engineering International, 10, 399-409.
239. ReliaSoft (2006) Degradation Analysis. Web reference. Available at: http://www.weibull.com/LifeDataWeb/degradation_analysis.htm.
240. US MIL-HDBK-781. Reliability Testing for Equipment Development, Qualification and Production. Available from the National Technical Information Service, Springfield, Virginia.
241. Wasserman, G. (2003) Reliability Verification, Testing, and Analysis in Engineering Design, Marcel Dekker.
242. Yates, S. (2008) Australian Defense Standard for Bayesian Reliability Demonstration. Proceedings of the Annual Reliability and Maintainability Symposium (RAMS), pp. 103-107.
243. ANSI/ASQ Z1-4. Sampling Procedures and Tables for Inspection by Attributes.
244. Bergman B. and Klefsjö, B. (2003) Quality: from Customer Needs to Customer Satisfaction, 3rd edn, McGraw-Hill.
245. Bhote, K.R. (1998) World Class Quality, American Management Association.
246. British Standard BS 6001. Sampling Procedures and Tables for Inspection by Attributes.
247. Davis, B. (1994) The Economics of Automatic Test Equipment, 2nd edn, McGraw-Hill.
248. Defeo, J. and Juran, J. (2010) Juran's Quality Handbook, 6th. edn, McGraw-Hill.
249. Deming, W.E. (1987) Out of the Crisis, MIT University Press.
250. Feigenbaum, A.V. (1991) Total Quality Control, 3rd edn, McGraw-Hill.
251. Grant, E.L. and Leavenworth, R.S. (1996) Statistical Quality Control, 6th edn, McGraw-Hill.
252. Hutchins, D.C. (1985) Quality Circles Handbook. Pitman.
253. Imai, M. (1997) Gemba Kaizen. McGraw-Hill.
254. Ishikawa, K. (1991) Guide to Quality Control. Chapman and Hall.
255. Jensen, F., Peterson, N.E. (1983) Burn-in: An Engineering Approach to the Design and Analysis of Burn-in Procedures. Wiley.
256. McLean, H. (2009) Halt, Hass, and Hasa Explained: Accelerated Reliability Techniques, American Society for Quality (ASQ) Publishing.
257. Montgomery, D.C. (2008) Introduction to Statistical Quality Control, Wiley.
258. Oakland, J.S. and Followell, R.F. (2003) Statistical Process Control, a Practical Guide, 5th edn, Butterworth-Heinemann.
259. O'Connor, P.D.T. (2001) Test Engineering, Wiley.
260. Quality Assurance. Journal of the Institute of Quality Assurance (UK).
261. Quality Progress. Journal of the American Society for Quality.
262. Thomas, B. (1995) The Human Dimension of Quality, McGraw-Hill.
263. Blanchard, B. and Fabrycky, W. (2011) Systems Engineering and Analysis, 5th edn, Prentice Hall.
264. Bloom, N. (2005) Reliability Centered Maintenance (RCM): Implementation Made Simple, McGraw-Hill.
265. Dhillon, B. (1999) Engineering Maintainability; How to Design for Reliability and Easy Maintenance, Gulf Publishing.
266. Jardine, A. and Tsang, A. (2005) Maintenance, Replacement and Reliability. Dekker.
267. Jones, J. (2006) Integrated Logistics Support Handbook, McGraw-Hill Logistics Series.
268. Morris, A. (1997) Measurement and Calibration Requirements for Quality Assurance to ISO9000, Wiley.
269. Moubray, J. (1999) Reliability Centred Maintenance, 2nd edn, Butterworth-Heinemann.
270. Smith, D. (2005) Reliability, Maintainability, and Risk, 7th edn, Elsevier.
271. UK Defence Standard 00-40. The Management of Reliability and Maintainability. HMSO.
272. US MIL-HDBK-1388. Integrated Logistic Support. Available from the National Technical Information Service, Springfield, Virginia.
273. US MIL-HDBK-470. Maintainability ProgramRequirements.Available from the National Technical Information Service, Springfield, Virginia.
274. US MIL-HDBK-472. Maintainability Prediction. Available from the National Technical Information Service, Springfield, Virginia.
275. Abbott, H. and Tyler, M. (1997) Safer by Design: a Guide to the Management and Law of Designing for Product Safety, Gower.
276. AIAG (2004) Reliability Methods Guideline. Developed by the Truck & Heavy Equipment Reliability Workgroup (THE-7). Available at http://www.aiag.org/staticcontent/committees/workgroup.cfm?workgroup=FTRM.
277. Barringer, P. (2011) Reliability Standards. Available at: http://www.barringer1.com/rs.htm.
278. Bergman, B. and Klefsjo, B. (1994) Quality: from Customer Needs to Customer Satisfaction, McGraw-Hill.
279. Breyfogle, F., Cupello, J. and Meadows, B. (2000) Managing Six Sigma, Wiley.
280. British Standard, BS 5760. Reliability of Systems, Equipments and Components. British Standards Institution, London.
281. Clausing, D. (1994) Total Quality Development, ASME Press.
282. Conti, T. (1993) Building Total Quality, Chapman and Hall.
283. Defence Standard 00-40: The Management of Reliability and Maintainability. HMSO UK.
284. Deming, W.E. (1987) Out of the Crisis, MIT Press.
285. Drucker, P. (1955) The Practice of Management, Heinemann.
286. Edosomwan, J. (1987) Integrating Quality and Productivity Management, Dekker.
287. GMW 3172 (2004) 'General Specification for Electrical/Electronic Component Analytical/Development/Validation (A/D/V) Procedures for Conformance to Vehicle Environmental, Reliability, and Performance Requirements', General Motors Worldwide Engineering standard. Available at www.global.ihs.com (Accessed 20 March 2011).
288. Hoyle, D. (2009) ISO 9000 Quality Systems Handbook (6th edition). Elsevier.
289. Hutchins, D. (1990) In Pursuit of Quality, Pitman.
290. IEC61508, Functional Safety of Electrical/Electronic/Programmable Electronic Safety-related Systems. International Standards Organisation.
291. IEEE (2008) Std 1624 IEEE Standard for Organizational Reliability Capability.
292. ISO/IEC60300, Dependability Management. International Standards Organization, Geneva.
293. ISO/IEC61508, Functional Safety of Electrical/Electronic/Programmable Electronic Safety-related Systems. International Standards Organization, Geneva.
294. ISO9000 (2000) Quality Systems. International Standards Organization, Geneva.
295. Kleyner, A. and Sandborn, P. (2008) Minimizing Life Cycle Cost by Managing Product Reliability via Validation Plan and Warranty Return Cost. International Journal of Production Economics (IJPE), 112, 796-807.
296. O'Connor, P.D.T. (2004) The New Management of Engineering. Available at www.lulu.com.
297. Pyzdek, T. (2001) The Six Sigma Handbook, McGraw-Hill.
298. Rabbitt, J. and Bergh, P. (1994) The ISO 9000 Book: A Global Competitor's Guide to Compliance and Certification, Amacom.
299. Rothery, B. (1996) Standards and Certification in Europe, Gower.
300. Silverman, M. (2010) How Reliable is Your Product? 50 Ways to Improve Product Reliability, Super Star Press, Silicon Valley, California.
301. Thomas, B. (1995) The Human Dimension of Quality, McGraw-Hill.
302. Tiku, S., Azarian, M. and Pecht, M. (2007) Using a Reliability Capability Maturity Model to Benchmark Electronics Companies, International Journal of Quality & Reliability Management, 24(5), 547-563.
303. Tiku, S. and Pecht, M. (2010) Validation of Reliability Capability Evaluation Model Using a Quantitative Assessment Process. International Journal of Quality & Reliability Management, 27(8), 938-952.
304. US MIL-STD-785. Reliability Programs for Systems and Equipment-Development and Production. Available from the National Technical Information Service, Springfield, Virginia.
305. Warranty Week (2011) The Newsletter for Warranty Management Professionals (online). Available at: http://www.warrantyweek.com/.